THERMAL MANAGEMENT SYSTEM FOR PORTABLE ELECTRONIC DEVICES

    公开(公告)号:US20230240039A1

    公开(公告)日:2023-07-27

    申请号:US18174495

    申请日:2023-02-24

    Abstract: A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

    THERMAL MANAGEMENT SYSTEM FOR PORTABLE ELECTRONIC DEVICES

    公开(公告)号:US20200383240A1

    公开(公告)日:2020-12-03

    申请号:US16885013

    申请日:2020-05-27

    Abstract: A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

Patent Agency Ranking