公开(公告)号：US08711607B2

公开(公告)日：2014-04-29

申请号：US13110068

申请日：2011-05-18

申请人： Masanao Yamaoka ,  Koichiro Ishibashi ,  Shigezumi Matsui ,  Kenichi Osada

发明人： Masanao Yamaoka ,  Koichiro Ishibashi ,  Shigezumi Matsui ,  Kenichi Osada

IPC分类号： G11C11/00

CPC分类号： G11C11/419 ,  G11C5/146 ,  G11C5/147 ,  G11C11/4125 ,  G11C11/417 ,  G11C2207/2227

摘要： A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

摘要翻译： 系统LSI中的逻辑电路设置有电源开关，以便在待机时切断开关，从而减少漏电流。 同时，系统LSI的SRAM电路控制衬底偏置以减少漏电流。

公开(公告)号：US08653645B2

公开(公告)日：2014-02-18

申请号：US13388990

申请日：2009-09-14

申请人： Masanao Yamaoka ,  Kenichi Osada

发明人： Masanao Yamaoka ,  Kenichi Osada

IPC分类号： H01L23/52

CPC分类号： H01L22/30 ,  H01L23/50 ,  H01L23/5286 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object of the present invention is to sufficiently supply power to three-dimensionally stacked LSI chips and to dispose common through vias in chips of different types. Also, another object is to propose a new test method for power-supply through silicon vias. In order to achieve these objects, a semiconductor device includes: a first circuit block formed on a first semiconductor substrate having first and second sides extending in a first direction and third and fourth sides extending in a second direction intersecting with the first direction; a plurality of signal-line through vias that are connected to the first semiconductor substrate and transmit signals, which are output from the first circuit block, to a second circuit block formed on another second semiconductor substrate; and a plurality of power-supply through vias for supplying power to the first circuit block, and in the semiconductor device, the plurality of power-supply through vias are formed at edges of the first semiconductor substrate along the third and fourth sides and are formed in a plurality of rows in the first direction. Also, each of the circuit blocks has a power consuming mode in which power larger than the power consumption in a normal mode is consumed.

摘要翻译： 本发明的目的是为三维堆叠的LSI芯片充分供电，并在通常的通孔中配置不同类型的芯片。 此外，另一个目的是提出一种通过硅通孔供电的新测试方法。 为了实现这些目的，半导体器件包括：第一电路块，形成在第一半导体衬底上，第一半导体衬底具有沿第一方向延伸的第一和第二侧面，以及沿与第一方向相交的第二方向延伸的第三和第四侧面; 连接到第一半导体衬底并将从第一电路块输出的发射信号的多个信号线通孔传送到形成在另一第二半导体衬底上的第二电路块; 以及多个用于向第一电路块提供电力的通孔的供电通道，并且在半导体器件中，多个电源通孔沿着第三和第四侧形成在第一半导体衬底的边缘处，并且形成 在第一方向上的多行中。 此外，每个电路块具有消耗大于正常模式下的功率消耗的功率的功耗模式。

公开(公告)号：US20100027322A1

公开(公告)日：2010-02-04

申请号：US12563231

申请日：2009-09-21

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Shigenobu Komatsu

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Shigenobu Komatsu

IPC分类号： G11C11/00 ,  G11C7/00

CPC分类号： G11C11/417

摘要： In this invention, high manufacturing yield is realized and variations in threshold voltage of each MOS transistor in a CMOS•SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. The threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is respectively programmed into control memories according to the results of determination. The levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS•SRAM are controlled to a predetermined error span. A body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.

摘要翻译： 在本发明中，实现了高制造成品率，并补偿了CMOS.SRAM中的每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作，写入操作和读取操作的任何活动模式中，将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据测定结果分别被编程到控制存储器中。 基于程序调整体偏置电压的电平，使得CMOS.SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。

公开(公告)号：US07646662B2

公开(公告)日：2010-01-12

申请号：US12325783

申请日：2008-12-01

申请人： Masanao Yamaoka ,  Koichiro Ishibashi ,  Shigezumi Matsui ,  Kenichi Osada

发明人： Masanao Yamaoka ,  Koichiro Ishibashi ,  Shigezumi Matsui ,  Kenichi Osada

IPC分类号： G11C5/14

CPC分类号： G11C11/419 ,  G11C5/146 ,  G11C5/147 ,  G11C11/4125 ,  G11C11/417 ,  G11C2207/2227

摘要： A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

摘要翻译： 系统LSI中的逻辑电路具有电源开关，以便在待机时切断开关，从而减少漏电流。 同时，系统LSI的SRAM电路控制衬底偏置以减少漏电流。

公开(公告)号：US07498637B2

公开(公告)日：2009-03-03

申请号：US11151455

申请日：2005-06-14

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Kiyoo Itoh ,  Takayuki Kawahara

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Kiyoo Itoh ,  Takayuki Kawahara

IPC分类号： H01L27/01 ,  H01L27/12 ,  H01L31/0392 ,  H01L27/11 ,  G11C11/00

CPC分类号： H01L27/11 ,  G11C11/412 ,  H01L21/84 ,  H01L27/108 ,  H01L27/1203 ,  Y10S257/903

摘要： A SRAM memory is composed of FD-SOI transistors, and performance of the memory cell is improved by controlling an electric potential of a layer under a buried oxide film of a SOI transistor constituting a driver transistor. Performance of the SRAM circuit in the low power voltage state is improved. In the SRAM memory cell composed of the FD-SOI transistor, an electric potential of a well under a BOX layer is controlled to control a threshold voltage Vth, thereby increasing a current. Thus, the operations of the memory cell can be stabilized.

摘要翻译： SRAM存储器由FD-SOI晶体管组成，通过控制构成驱动晶体管的SOI晶体管的埋入氧化膜下​​的层的电位来提高存储单元的性能。 提高了处于低功率电压状态的SRAM电路的性能。 在由FD-SOI晶体管构成的SRAM存储单元中，控制BOX层下的阱的电位来控制阈值电压Vth，从而增加电流。 因此，可以稳定存储单元的操作。

公开(公告)号：US20080316800A1

公开(公告)日：2008-12-25

申请号：US12222753

申请日：2008-08-15

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Kazumasa Yanagisawa

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Kazumasa Yanagisawa

IPC分类号： G11C11/00

CPC分类号： G11C11/417 ,  G11C5/14 ,  G11C5/148

摘要： When threshold voltages of constituent transistors are reduced in order to operate an SRAM circuit at a low voltage, there is a problem in that a leakage current of the transistors is increased and, as a result, electric power consumption when the SRAM circuit is not operated while storing data is increased. Therefore, there is provided a technique for reducing the leakage current of MOS transistors in SRAM memory cells MC by controlling a potential of a source line ssl of the driver MOS transistors in the memory cells.

摘要翻译： 当降低构成晶体管的阈值电压以便在低电压下操作SRAM电路时，存在晶体管的漏电流增加的问题，结果是当SRAM电路不工作时的功耗 同时存储数据增加。 因此，提供了通过控制存储单元中的驱动器MOS晶体管的源极线ssl的电位来减小SRAM存储单元MC中的MOS晶体管的漏电流的技术。

公开(公告)号：US20080247220A1

公开(公告)日：2008-10-09

申请号：US12133343

申请日：2008-06-04

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Koichiro Ishibashi

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Koichiro Ishibashi

IPC分类号： G11C11/00

CPC分类号： G11C11/417 ,  G11C11/412 ,  Y10S257/903

摘要： A memory using an SRAM memory cell intended for low-voltage operation is designed to decrease the threshold value of MOS transistors constituting the memory cell without substantial decrease in the static noise margin, which is the operational margin of the memory cell. To this end, a voltage Vdd′ higher than a power supply voltage Vdd of a power supply line for peripheral circuits is supplied from a power supply line for memory cells as a power supply voltage for memory cells. Since the conductance of driver MOS transistors is in-creased, the threshold voltage of the MOS transistors within the memory cells can be reduced without reducing the static noise margin. Further the ratio of width between the driver MOS transistor and a transfer MOS transistor can be set to 1, thereby allowing a reduction in the memory cell area.

摘要翻译： 使用用于低电压操作的SRAM存储单元的存储器被设计为降低构成存储器单元的MOS晶体管的阈值，而不会显着降低静态噪声容限，这是存储单元的操作余量。 为此，作为存储单元的电源电压，从用于存储单元的电源线提供高于外围电路用电源线的电源电压Vdd的电压Vdd'。 由于驱动器MOS晶体管的电导被增加，所以可以在不降低静态噪声容限的情况下减小存储单元内的MOS晶体管的阈值电压。 此外，可以将驱动器MOS晶体管和转移MOS晶体管之间的宽度比设置为1，从而允许存储单元区域的减小。

公开(公告)号：US20080117692A1

公开(公告)日：2008-05-22

申请号：US12003970

申请日：2008-01-04

申请人： Masanao Yamaoka ,  Kenichi Osada

发明人： Masanao Yamaoka ,  Kenichi Osada

IPC分类号： G11C5/14

CPC分类号： G11C29/02 ,  G11C5/146 ,  G11C5/147 ,  G11C11/41 ,  G11C11/412 ,  G11C11/413 ,  G11C11/417 ,  G11C11/419 ,  G11C29/021 ,  G11C29/028 ,  G11C2029/0409

摘要： An SRAM circuit operates at a reduced operation margin, especially at a low operating voltage by increasing or optimizing the operation margin of the SRAM circuit. The threshold voltage of the produced transistor in the SRAM circuit is detected to compare the operating voltage of a memory cell with the operating voltage of a peripheral circuit in order to adjust it to the optimum value, and the substrate bias voltage is further controlled.

公开(公告)号：US07190609B2

公开(公告)日：2007-03-13

申请号：US10926032

申请日：2004-08-26

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Koichiro Ishibashi

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Koichiro Ishibashi

IPC分类号： G11C11/00

CPC分类号： G11C11/417 ,  G11C11/412 ,  Y10S257/903

摘要： A memory using an SRAM memory cell intended for low-voltage operation is designed to decrease the threshold value of MOS transistors constituting the memory cell without substantial decrease in the static noise margin, which is the operational margin of the memory cell. To this end, a voltage Vdd′ higher than a power supply voltage Vdd of a power supply line for peripheral circuits is supplied from a power supply line for memory cells as a power supply voltage for memory cells. Since the conductance of driver MOS transistors is increased, the threshold voltage of the MOS transistors within the memory cells can be reduced without reducing the static noise margin. Further the ratio of width between the driver MOS transistor and a transfer MOS transistor can be set to 1, thereby allowing a reduction in the memory cell area.

摘要翻译： 使用用于低电压操作的SRAM存储单元的存储器被设计为降低构成存储器单元的MOS晶体管的阈值，而不会显着降低静态噪声容限，这是存储单元的操作余量。 为此，作为存储单元的电源电压，从用于存储单元的电源线提供高于外围电路用电源线的电源电压Vdd的电压Vdd'。 由于驱动器MOS晶体管的电导增加，所以可以在不降低静态噪声容限的情况下减小存储单元内的MOS晶体管的阈值电压。 此外，可以将驱动器MOS晶体管和转移MOS晶体管之间的宽度比设置为1，从而允许存储单元区域的减小。

公开(公告)号：US20050276094A1

公开(公告)日：2005-12-15

申请号：US11151455

申请日：2005-06-14

申请人： Masanao Yamaoka ,  Kenichi Osada ,  Kiyoo Itoh ,  Takayuki Kawahara

发明人： Masanao Yamaoka ,  Kenichi Osada ,  Kiyoo Itoh ,  Takayuki Kawahara

IPC分类号： G11C11/00 ,  G11C11/412 ,  H01L21/8244 ,  H01L27/108

CPC分类号： H01L27/11 ,  G11C11/412 ,  H01L21/84 ,  H01L27/108 ,  H01L27/1203 ,  Y10S257/903

摘要： A SRAM memory is composed of FD-SOI transistors, and performance of the memory cell is improved by controlling an electric potential of a layer under a buried oxide film of a SOI transistor constituting a driver transistor. Performance of the SRAM circuit in the low power voltage state is improved. In the SRAM memory cell composed of the FD-SOI transistor, an electric potential of a well under a BOX layer is controlled to control a threshold voltage Vth, thereby increasing a current. Thus, the operations of the memory cell can be stabilized.

摘要翻译： SRAM存储器由FD-SOI晶体管组成，通过控制构成驱动晶体管的SOI晶体管的埋入氧化膜下​​的层的电位来提高存储单元的性能。 提高了处于低功率电压状态的SRAM电路的性能。 在由FD-SOI晶体管构成的SRAM存储单元中，控制BOX层下的阱的电位来控制阈值电压Vth，从而增加电流。 因此，可以稳定存储单元的操作。