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公开(公告)号：US11415863B2
公开(公告)日：2022-08-16
申请号：US17264904
申请日：2018-08-03
发明人： Zhenyu Chen , Yinli Fang , Hailing Ding
摘要： A variable aperture device, which is suitable for photographing and filming of a camera module, includes a main body, a fluid passage, and a fluid accommodation cavity, wherein the main body is used to be provided in the camera module, and the main body has a light-transmitting region, the fluid passage is provided in the light-transmitting region of the main body, the fluid accommodation cavity is in communication with the fluid passage for an light-impermeable fluid to be driven to flow back and forth between the fluid accommodation cavity and the fluid passage to enlarge or reduce the light transmission area of the light-transmitting region.
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公开(公告)号：US11363184B2
公开(公告)日：2022-06-14
申请号：US17203673
申请日：2021-03-16
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US11223751B2
公开(公告)日：2022-01-11
申请号：US16747455
申请日：2020-01-20
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US11128787B2
公开(公告)日：2021-09-21
申请号：US16471114
申请日：2017-12-20
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
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25.发明授权公开(公告)号：US11094727B2
公开(公告)日：2021-08-17
申请号：US16604715
申请日：2018-04-12
发明人： Mingzhu Wang , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Bojie Zhao
摘要： Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.
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公开(公告)号：US10986258B2
公开(公告)日：2021-04-20
申请号：US16569601
申请日：2019-09-12
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , H05K1/02 , H05K1/18 , H05K3/28 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US10827103B2
公开(公告)日：2020-11-03
申请号：US16311894
申请日：2017-06-23
发明人： Zhenyu Chen , Mingzhu Wang , Xiaojuan Su , Bojie Zhao
摘要： The present invention provides a fixed-focus camera module and a manufacturing method therefor. The fixed-focus camera module comprises a light-sensitive chip, an optical lens assembly, and a lens base. The optical lens assembly is directed packaged in the lens base, and the optical lens assembly is kept in a light-sensitive path of the light-sensitive chip. In this manner, the size and the manufacturing costs of the fixed-focus camera module can be effectively reduced, so as to improve the product competitiveness of the fixed-focus camera module.
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公开(公告)号：US10708480B2
公开(公告)日：2020-07-07
申请号：US16028367
申请日：2018-07-05
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US10321028B2
公开(公告)日：2019-06-11
申请号：US15473565
申请日：2017-03-29
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US10230879B2
公开(公告)日：2019-03-12
申请号：US15679154
申请日：2017-08-17
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： G02B7/02 , G02B7/10 , H04N5/225 , B29C33/44 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , B29C45/00 , B29C45/14 , B29C45/40 , B29C70/72 , B29C70/88 , B29D11/00 , B29L31/00 , B29L31/34 , G02B13/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
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