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公开(公告)号：US10126183B2
公开(公告)日：2018-11-13
申请号：US15486632
申请日：2017-04-13
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst , Jeremy Crank
Abstract: An example actuator device for a force sensor is described herein. The device can include a device body, a force concentrator element, an overload protection element, one or more legs, and an attachment layer for attaching the device to a substrate. An example method for assembling a force sensing system is also described herein. Further, an example method for protecting a force sensor from excessive forces or displacement is described herein.
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公开(公告)号：US09902611B2
公开(公告)日：2018-02-27
申请号：US15111044
申请日：2015-01-13
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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公开(公告)号：US20170308197A1
公开(公告)日：2017-10-26
申请号：US15492127
申请日：2017-04-20
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
IPC: G06F3/044
Abstract: An example force-sensitive electronic device is described herein. The device can include a device body, a touch surface bonded to the device body in a bonded region that is arranged along a peripheral edge of the touch surface, and a plurality of force sensors that are arranged between the device body and the touch surface. Each of the plurality of force sensors can be spaced apart from the bonded region.
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公开(公告)号：US20230016531A1
公开(公告)日：2023-01-19
申请号：US17860941
申请日：2022-07-08
Applicant: NextInput, Inc.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
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公开(公告)号：US11255737B2
公开(公告)日：2022-02-22
申请号：US16485016
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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Patent Agency Ranking
公开(公告)号：US10817061B2
公开(公告)日：2020-10-27
申请号：US16119033
申请日：2018-08-31
Applicant: JOYSON SAFETY SYSTEMS ACQUISITION LLC , NextInput, Inc.
Inventor： David Andrews , Ian Campbell , Ryan Diestelhorst , Jason Carl Lisseman , Don Metzger
IPC: G09G5/00 , G06F3/01 , B60K35/00 , G06F3/041 , B60K37/06 , G06F3/0354 , B60R16/023 , B60W50/16 , G06F3/16
Abstract: A multi-dimensional track pad is described that acts as human-machine interface (HMI). Inputs to the HMI can be made not only using the tradition two-dimensional (X-Y) inputs of a track pad, but also a third dimension, force, and even a fourth dimension, time. Tactile or audible feedback to the inputs can be provided. Methods of using the HMI to control a system are described as well as a track pad system that utilizes the HMI in communication with a processor.
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公开(公告)号：US20190383675A1
公开(公告)日：2019-12-19
申请号：US16485026
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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公开(公告)号：US20180179050A1
公开(公告)日：2018-06-28
申请号：US15904631
申请日：2018-02-26
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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公开(公告)号：US20140007705A1
公开(公告)日：2014-01-09
申请号：US13934900
申请日：2013-07-03
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
CPC classification number: G01L1/18 , B81B3/0018 , B81C1/00134 , G01L1/148 , G01L1/26 , G01L5/162
Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.
Abstract translation: 本文描述了用于测量人类用户施加的力的微机电（“MEMS”）负载传感器装置。 在一个方面，负载传感器装置具有与触摸表面连通的接触表面，该接触表面将起始于触摸表面的力连接到可变形的膜上，负载传感器元件布置在其上，使得负载传感器装置产生与 由人类使用者沿着触摸表面施加的力。 在另一方面，负载传感器装置具有过载保护环以保护负载传感器装置免受过大的力。 在另一方面，负载传感器装置具有嵌入式逻辑电路，以允许微控制器分别地组织成阵列的负载传感器装置。 在另一方面，负载传感器装置具有电气和机械连接器，例如设计成最小化最终部件制造成本的焊料凸块。
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公开(公告)号：US20130096849A1
公开(公告)日：2013-04-18
申请号：US13649526
申请日：2012-10-11
Applicant: NextInput Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
IPC: G06F19/00
CPC classification number: G06F3/0414 , G06F2203/04102 , G06F2203/04104
Abstract: An interface device for measuring forces applied to the interface device. The interface device has a flexible contact surface suspended above a rigid substrate. The interface device has at least one sensor in communication with the contact surface. The interface device has processing circuitry for receiving signals from the sensors and substantially instantaneously producing an output signal corresponding to the location and force applied in multiple locations across the contact surface.
Abstract translation: 一种用于测量施加到接口装置的力的接口装置。 接口装置具有悬挂在刚性基板上方的柔性接触表面。 接口装置具有与接触表面连通的至少一个传感器。 接口装置具有用于接收来自传感器的信号的处理电路，并基本上瞬间产生对应于穿过接触表面的多个位置施加的位置和力的输出信号。
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