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公开(公告)号：US11255737B2
公开(公告)日：2022-02-22
申请号：US16485016
申请日：2018-02-09
申请人： NEXTINPUT, INC.
摘要： In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US20190383676A1
公开(公告)日：2019-12-19
申请号：US16485016
申请日：2018-02-09
申请人： NEXTINPUT, INC.
摘要： Described herein is a ruggedized wafer level microelectromechanical (“MEMS”) force sensor including a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US11946817B2
公开(公告)日：2024-04-02
申请号：US17676477
申请日：2022-02-21
申请人： NEXTINPUT, INC.
CPC分类号： G01L1/18 , B81B7/02 , B81C1/00246 , G01L1/14 , G01L1/16 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81B2207/07 , B81C2201/013 , B81C2203/0109 , B81C2203/0714 , B81C2203/0728
摘要： In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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公开(公告)号：US11874183B2
公开(公告)日：2024-01-16
申请号：US17615208
申请日：2020-06-01
申请人： NEXTINPUT, INC.
发明人： Michael Dueweke , Allan Liu , Dan Benjamin
IPC分类号： G01L5/00
CPC分类号： G01L5/0028
摘要： Described herein is a method and system for testing a force or strain sensor in a continuous fashion. The method employs a sensor, a test fixture, a load cell, a mechanical actuator and tester hardware and software to simultaneously record signal outputs from the sensor and load cell as functions of time. The method provides time synchronization events for recording data streams between, for example, a linear ramp of the force on, or displacement of, the sensor and for extracting performance characteristics from the data in post-test processing.
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公开(公告)号：US20220268648A1
公开(公告)日：2022-08-25
申请号：US17676477
申请日：2022-02-21
申请人： NEXTINPUT, INC.
摘要： In one embodiment, a ruggedized wafer level microelectromechanical (“MEMS”) force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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