公开(公告)号：US4919731A

公开(公告)日：1990-04-24

申请号：US308450

申请日：1989-02-10

Applicant: Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase ,  Masako Nakahashi ,  Hiromitsu Takeda

Inventor： Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase ,  Masako Nakahashi ,  Hiromitsu Takeda

IPC: H01R43/02 ,  B23K35/363 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L2924/00013 ,  H01L2924/0002 ,  Y10T29/49149

Abstract: The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts, which comprises the step of attaching terminal pins to a high thermal conductivity ceramics circuit board by a brazing paste layer comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.

公开(公告)号：US4906341A

公开(公告)日：1990-03-06

申请号：US247619

申请日：1988-09-22

Applicant: Koji Yamakawa ,  Kaoru Koiwa ,  Nobuo Iwase

Inventor： Koji Yamakawa ,  Kaoru Koiwa ,  Nobuo Iwase

IPC: H01L21/60

CPC classification number: H01L24/11 ,  H01L2224/1147 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082

Abstract: A plating solution is stored in an annular plating solution storage. A plating solution tank having an open upper portion is arranged in a hollow portion of the storage. A mesh-like anode electrode is arranged on the bottom portion of the plating tank. Hold members are attached to an upper side wall of the plating tank. One of the hold members is in contact with a portion to be plated of a semiconductor member and serves as a cathode electrode. The anode and cathode electrodes are connected to a DC power source. The plating solution in the plating solution tank is brought into contact with the portion to be plated and is isolated therefrom by an driving pump intermittently driven at predetermined intervals using an intermittent drive unit. The power source is kept in the ON state while the plating solution is in contact with the portion to be plated, there-by forming a plated layer on the portion to be plated.