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82 条记录 (耗时 0.078 秒)

    Isolation of sensing and stimulation circuitry
    24.
    发明授权
    Isolation of sensing and stimulation circuitry 有权
    感测和刺激电路的隔离

    公开(公告)号：US08560060B2

    公开(公告)日：2013-10-15

    申请号：US12551377

    申请日：2009-08-31

    申请人： William T. Donofrio ,  Paul G. Krause ,  James D. Reinke ,  David J. Peichel ,  Gerald P. Arne

    发明人： William T. Donofrio ,  Paul G. Krause ,  James D. Reinke ,  David J. Peichel ,  Gerald P. Arne

    IPC分类号： A61N1/16

    CPC分类号： A61N1/37 ,  A61N1/36125 ,  A61N1/3718 ,  A61N1/378 ,  A61N1/3962

    摘要： The disclosure describes techniques of reducing or eliminating a commonality between two modules within the same implantable medical device. Each module within the implantable medical device provides therapy to a patient. The commonality between the two modules exists due to at least one common component shared by the two modules. The commonality between the two modules may create common-mode interference and a shunt current. In accordance with this disclosure, various isolation circuits located at various locations are disclosed to reduce or eliminate the commonality between the two modules. The reduction or elimination of the commonality between the two modules may reduce or eliminate common-mode interference and the shunt current.

    摘要翻译： 本公开描述了减少或消除同一可植入医疗装置内的两个模块之间的共同性的技术。 可植入医疗装置内的每个模块向患者提供治疗。 由于两个模块共享的至少一个公共组件，存在两个模块之间的通用性。 两个模块之间的通用性可能会产生共模干扰和分流电流。 根据本公开，公开了位于各个位置处的各种隔离电路，以减少或消除两个模块之间的共同性。 减少或消除两个模块之间的通用性可以减少或消除共模干扰和分流电流。

    ISOLATION OF SENSING AND STIMULATION CIRCUITRY
    29.
    发明申请
    ISOLATION OF SENSING AND STIMULATION CIRCUITRY 有权
    感测和刺激电路的分离

    公开(公告)号：US20100114248A1

    公开(公告)日：2010-05-06

    申请号：US12551409

    申请日：2009-08-31

    申请人： William T. Donofrio ,  Paul G. Krause ,  James D. Reinke ,  David J. Peichel

    发明人： William T. Donofrio ,  Paul G. Krause ,  James D. Reinke ,  David J. Peichel

    IPC分类号： A61N1/08

    CPC分类号： A61N1/378 ,  A61N1/025 ,  A61N1/37 ,  A61N1/3718 ,  A61N1/3962

    摘要： The disclosure describes techniques of reducing or eliminating a commonality between two modules within the same implantable medical device. Each module within the implantable medical device provides therapy to a patient. The commonality between the two modules exists due to at least one common component shared by the two modules. The commonality between the two modules may create common-mode interference and a shunt current. In accordance with this disclosure, various isolation circuits located at various locations are disclosed to reduce or eliminate the commonality between the two modules. The reduction or elimination of the commonality between the two modules may reduce or eliminate common-mode interference and the shunt current.

    摘要翻译： 本公开描述了减少或消除同一可植入医疗装置内的两个模块之间的共同性的技术。 可植入医疗装置内的每个模块向患者提供治疗。 由于两个模块共享的至少一个公共组件，存在两个模块之间的通用性。 两个模块之间的通用性可能会产生共模干扰和分流电流。 根据本公开，公开了位于各个位置处的各种隔离电路，以减少或消除两个模块之间的共同性。 减少或消除两个模块之间的通用性可以减少或消除共模干扰和分流电流。

    Communication dipole for implantable medical device
    30.
    发明授权
    Communication dipole for implantable medical device 有权
    用于可植入医疗器械的通信偶极子

    公开(公告)号：US08515559B2

    公开(公告)日：2013-08-20

    申请号：US13359886

    申请日：2012-01-27

    申请人： Jonathan P. Roberts ,  Can Cinbis ,  David J. Peichel ,  James C. Allan ,  James D. Reinke ,  Kamal Deep Mothilal ,  Erik Griswold ,  George Patras

    发明人： Jonathan P. Roberts ,  Can Cinbis ,  David J. Peichel ,  James C. Allan ,  James D. Reinke ,  Kamal Deep Mothilal ,  Erik Griswold ,  George Patras

    IPC分类号： A61N1/00

    CPC分类号： A61N1/37205 ,  A61B5/0028 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/6876 ,  A61B5/6882 ,  A61B2562/0247 ,  A61N1/37217 ,  H04B13/005

    摘要： This disclosure is directed to an implantable medical device having a communication dipole configured in accordance with the techniques described herein. In one example, the disclosure is directed to an implantable medical device comprising a housing that encloses at least a communication module, a first electrode of a communication dipole electrically coupled to the communication module and an electrically conductive fixation mechanism that is electrically coupled to a portion of the housing and wherein a portion of the fixation mechanism is configured to function as at least part of a second electrode of the communication dipole. The electrically conductive fixation mechanism includes a dielectric material that covers at least part of a surface of the fixation mechanism. The communication module is configured to transmit or receive a modulated signal between the first electrode and second electrode of the communication dipole.

    摘要翻译： 本公开涉及具有根据本文所描述的技术配置的通信偶极子的可植入医疗装置。 在一个示例中，本公开涉及可植入医疗装置，其包括壳体，该壳体至少包围通信模块，电耦合到通信模块的通信偶极子的第一电极和电连接到通信模块的部分的导电固定机构 并且其中所述固定机构的一部分被配置为用作所述通信偶极子的第二电极的至少一部分。 导电固定机构包括覆盖固定机构的表面的至少一部分的电介质材料。 通信模块被配置为在通信偶极子的第一电极和第二电极之间发送或接收调制信号。