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公开(公告)号：US20200172391A1
公开(公告)日：2020-06-04
申请号：US16783627
申请日：2020-02-06
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING-HAN TSAI , YU-TAO LEE
IPC: B81B3/00 , H01L27/146 , B81C1/00 , H01L23/00
Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
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公开(公告)号：US20190025127A1
公开(公告)日：2019-01-24
申请号：US16144249
申请日：2018-09-27
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
CPC classification number: G01J5/048 , G01J5/0025 , G01J5/043 , G01J5/0862 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20220163381A1
公开(公告)日：2022-05-26
申请号：US17669774
申请日：2022-02-11
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , PO-WEI YU
Abstract: An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.
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公开(公告)号：US20220146115A1
公开(公告)日：2022-05-12
申请号：US17584755
申请日：2022-01-26
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHIUNG-WEN LIN , PO-WEI YU , WEI-MING WANG , SEN-HUANG HUANG
Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.
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公开(公告)号：US20220136905A1
公开(公告)日：2022-05-05
申请号：US17578691
申请日：2022-01-19
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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Patent Agency Ranking
公开(公告)号：US20210199507A1
公开(公告)日：2021-07-01
申请号：US17200713
申请日：2021-03-12
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20210108973A1
公开(公告)日：2021-04-15
申请号：US17130103
申请日：2020-12-22
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN
Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed.
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公开(公告)号：US20210022489A1
公开(公告)日：2021-01-28
申请号：US17065865
申请日：2020-10-08
Applicant: PixArt Imaging Inc.
Inventor： CHIH-MING SUN , MING SHUN MANSON FEI , YI-HSIEN KO
Abstract: There is provided an electric toothbrush including a toothbrush head, a toothbrush handle and a force sensing array. The force sensing array is arranged on the toothbrush head and/or the toothbrush handle. When the force sensing array is arranged on the toothbrush head, it is able to detect the force uniformity of brush hairs. When the force sensing array is arranged on the toothbrush handle, it is able to control the vibration strength of the brush hairs and detect the pressing force of the brush hairs.
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公开(公告)号：US20200319033A1
公开(公告)日：2020-10-08
申请号：US16906002
申请日：2020-06-19
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20200240846A1
公开(公告)日：2020-07-30
申请号：US16850187
申请日：2020-04-16
Applicant: PIXART IMAGING INC.
Inventor： CHIH-MING SUN , MING-HAN TSAI , CHENG-NAN TSAI
Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.
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