公开(公告)号：US20150216044A1

公开(公告)日：2015-07-30

申请号：US14581460

申请日：2014-12-23

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Hiroki YAMAMOTO

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09 ,  H05K5/00 ,  H05K1/11

CPC classification number: H01L27/016 ,  H01C1/14 ,  H01C1/142 ,  H01C7/003 ,  H01C7/006 ,  H01C17/006 ,  H01G4/012 ,  H01G4/30 ,  H01G4/33 ,  H01L27/0802 ,  H01L27/0805 ,  H01L28/20 ,  H01L28/60 ,  H05K1/167 ,  Y10T29/49158

Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

Abstract translation: 本发明的芯片部分包括基板，基板上的电极，并且具有朝向其厚度方向形成有多个凹部的前表面，以及元件区域，电路元件电连接到 电极。