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公开(公告)号：US11012789B2
公开(公告)日：2021-05-18
申请号：US16021511
申请日：2018-06-28
Applicant: Robert Bosch Gmbh , Akustica, Inc.
Inventor： Christoph Hermes , Bernhard Gehl , Arnim Hoechst , Daniel Meisel , Andrew Doller , Yujie Zhang , Gokhan Hatipoglu
Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.
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Patent Agency Ranking
公开(公告)号：US10981777B2
公开(公告)日：2021-04-20
申请号：US16464200
申请日：2017-11-27
Applicant: Robert Bosch GmbH
Inventor： Andrew Doller , Gokhan Hatipoglu , Yujie Zhang , Bernhard Gehl , Daniel Christoph Meisel
IPC: B81B3/00
Abstract: A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.
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公开(公告)号：US20190389721A1
公开(公告)日：2019-12-26
申请号：US16464200
申请日：2017-11-27
Applicant: Robert Bosch GmbH
Inventor： Andrew Doller , Gokhan Hatipoglu , Yujie Zhang , Bernhard Gehl , Daniel Christoph Meisel
IPC: B81B3/00
Abstract: A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.
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24.发明申请Method for manufacturing a microphone structure and a pressure sensor structure in the layer structure of a mems element 有权用于制造在mems元件的层结构中的麦克风结构和压力传感器结构的方法公开(公告)号：US20160304336A1
公开(公告)日：2016-10-20
申请号：US15098462
申请日：2016-04-14
Applicant: Robert Bosch GmbH
Inventor： Florian Schoen , Bernhard Gehl
CPC classification number: B81B7/02 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00214 , B81C2201/0109 , B81C2201/013 , G01L1/148 , G01L9/12 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.
Abstract translation: 一种MEMS元件的制造方法，其中包括麦克风电容器的麦克风和包括测量电容器的压力传感器都在MEMS结构中实现。 麦克风和压力传感器的部件在MEMS结构的层中平行但独立地形成。 压力传感器隔膜由用作麦克风隔膜的基底层的第一层构成。 测量电容器的固定对电极由用作麦克风的隔膜层的导电第二层构成。 固定压力传感器对元件由第三层和第四层构成。 第三层在麦克风结构的区域中作为牺牲层起作用，其麦克风结构区域中的厚度决定了麦克风电容器的电极距离。 麦克风相对元件由第四层构成。
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公开(公告)号：US09369804B2
公开(公告)日：2016-06-14
申请号：US14444136
申请日：2014-07-28
Applicant: Akustica, Inc. , Robert Bosch GmbH
Inventor： Thomas Buck , John Zinn , Andy Doller , Brett Diamond , Bernhard Gehl
IPC: H01L29/84 , H01L23/58 , H01L27/088 , H01L23/48 , H04R7/06 , H04R19/00 , H04R19/04 , H04R7/20 , H04R31/00
CPC classification number: H04R7/06 , H04R7/20 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2207/021
Abstract: A micro electrical mechanical system (MEMS) device in one embodiment includes a substrate defining a back cavity, a membrane above the back cavity, a back plate above the membrane, and a first overtravel stop (OTS) positioned at least partially directly beneath the membrane and supported by the back plate.
Abstract translation: 在一个实施例中，微电机械系统（MEMS）装置包括限定后腔的衬底，位于所述后腔上方的膜，所述膜上方的背板以及至少部分地直接位于所述膜下方的第一超行程停止（OTS） 并由背板支撑。
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公开(公告)号：US20160029126A1
公开(公告)日：2016-01-28
申请号：US14444136
申请日：2014-07-28
Applicant: Akustica, Inc. , Robert Bosch GmbH
Inventor： Thomas Buck , John Zinn , Andy Doller , Brett Diamond , Bernhard Gehl
CPC classification number: H04R7/06 , H04R7/20 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2207/021
Abstract: A micro electrical mechanical system (MEMS) device in one embodiment includes a substrate defining a back cavity, a membrane above the back cavity, a back plate above the membrane, and a first overtravel stop (OTS) positioned at least partially directly beneath the membrane and supported by the back plate.
Abstract translation: 在一个实施例中，微电机械系统（MEMS）装置包括限定后腔的衬底，位于所述后腔上方的膜，所述膜上方的背板以及至少部分地直接位于所述膜下方的第一超行程停止（OTS） 并由背板支撑。
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