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公开(公告)号：US20230118574A1
公开(公告)日：2023-04-20
申请号：US18083749
申请日：2022-12-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.
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公开(公告)号：US20200335260A1
公开(公告)日：2020-10-22
申请号：US16922335
申请日：2020-07-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
IPC: H01F27/28 , H01F27/255 , H01F27/29 , H01F41/04 , H01F41/02
Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.
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公开(公告)号：US20200075228A1
公开(公告)日：2020-03-05
申请号：US16677101
申请日：2019-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
Abstract: There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≤15 μm and b/a≥7 are satisfied.
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公开(公告)号：US20170040101A1
公开(公告)日：2017-02-09
申请号：US15098938
申请日：2016-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
IPC: H01F27/28 , H01F41/02 , H01F41/04 , H01F27/255 , H01F27/29
CPC classification number: H01F27/2804 , H01F27/255 , H01F27/29 , H01F41/0233 , H01F41/042
Abstract: A coil electronic component includes a magnetic body having an internal coil part embedded therein, in which the internal coil part includes an insulating substrate, a first insulator, a coil conductor, and a second insulator. The first insulator is disposed on at least one of first and second main surfaces of the insulating substrate and has a groove formed therein. The coil conductor is formed inside the groove. The second insulator encloses the insulating substrate, the first insulator, and the coil conductor. The first insulator may be formed to a thickness larger than (and no more than 40 μm thicker than) a thickness of the coil conductor on the insulating substrate. The first insulator may be formed to a width of 3 μm to 50 μm. Further, the second insulator may extend to a thickness 1 μm to 20 μm larger than that of the first insulator on the insulating substrate.
Abstract translation: 线圈电子部件包括具有嵌入其中的内部线圈部分的磁体，其中内部线圈部分包括绝缘基板，第一绝缘体，线圈导体和第二绝缘体。 第一绝缘体设置在绝缘基板的第一主表面和第二主表面中的至少一个上，并且在其中形成有凹槽。 线圈导体形成在槽内。 第二绝缘体包围绝缘基板，第一绝缘体和线圈导体。 第一绝缘体可以形成为比绝缘基板上的线圈导体的厚度大（并且不超过40μm）的厚度。 第一绝缘体可以形成为3μm至50μm的宽度。 此外，第二绝缘体可以延伸到比绝缘基板上的第一绝缘体的厚度大1μm至20μm的厚度。
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公开(公告)号：US20160217903A1
公开(公告)日：2016-07-28
申请号：US14934986
申请日：2015-11-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
CPC classification number: H01F17/0013 , H01F17/04 , H01F27/292
Abstract: An electronic component includes a first magnetic body in which a first internal coil part is embedded; a second magnetic body in which a second internal coil part is embedded; and a spacer part disposed between the first and second magnetic bodies and connecting the first and second magnetic bodies to each other.
Abstract translation: 电子部件包括嵌入有第一内部线圈部的第一磁性体; 嵌入第二内部线圈部的第二磁性体; 以及设置在第一和第二磁体之间并将第一和第二磁体彼此连接的间隔部分。
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Patent Agency Ranking
公开(公告)号：US20160111193A1
公开(公告)日：2016-04-21
申请号：US14676758
申请日：2015-04-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
CPC classification number: H01F17/0013 , H01F17/06 , H01F27/292 , H01F2017/048
Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns
Abstract translation: 芯片电子部件包括具有绝缘基板的磁体和形成在绝缘基板的至少一个面上的内部线圈部。 内部线圈部分包括形成在绝缘基板上的第一线圈图案，设置在第一线圈图案上的第二线圈图案和设置在第二线圈图案上的第三线圈图案，以及与第一至第三线圈图案区分开的界面部分设置在 第一和第二线圈图案之间的界面中的至少一个以及第二和第三线圈图案之间的界面
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公开(公告)号：US20160104564A1
公开(公告)日：2016-04-14
申请号：US14691285
申请日：2015-04-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
IPC: H01F27/28 , H01F27/255
CPC classification number: H01F17/0013 , H01F17/06 , H01F27/292 , H01F2017/048
Abstract: There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
Abstract translation: 提供了具有相同功能的芯片电子元件。 芯片电子部件包括：基板; 设置在所述基板的一个表面上的第一内部线圈部分; 第二内部线圈部分，设置在所述基板的与其一个表面相对的另一个表面上; 穿过所述基板以将所述第一和第二内部线圈部彼此连接的通孔; 以及分别设置在基板的一个表面和另一个表面上以覆盖通孔的第一和第二通孔焊盘，其中第一和第二通孔焊盘沿着与其相邻的第一和第二内部线圈部件的部分的方向延伸。
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公开(公告)号：US20150170823A1
公开(公告)日：2015-06-18
申请号：US14284236
申请日：2014-05-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG , Sung Hoon KIM , Byung Seung MIN
CPC classification number: C25D7/001 , C25D5/022 , C25D5/10 , H01F17/0013 , H01F27/292 , H01F41/046 , H01F2017/048
Abstract: There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.
Abstract translation: 提供了一种芯片电子部件，包括：包括绝缘基板的磁体; 形成在所述绝缘基板的至少一个表面上的内部线圈部; 以及外部电极，形成在所述磁性体的端面上并且与所述内部线圈部连接，所述内部线圈部包括形成在所述绝缘基板上的第一线圈图案和形成为涂覆所述第一线圈图案的第二线圈图案，以及 第一线圈图案的上表面的宽度a相对于第一线圈图案的下表面的宽度b的比a / b小于1。
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公开(公告)号：US20130169404A1
公开(公告)日：2013-07-04
申请号：US13730679
申请日：2012-12-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG , Hyeog Soo SHIN
IPC: H01F27/28
CPC classification number: H01F27/29 , H01F3/14 , H01F17/0033 , H01F27/2804 , H01F27/292 , H01F2027/2809
Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.
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公开(公告)号：US20190043659A1
公开(公告)日：2019-02-07
申请号：US16152913
申请日：2018-10-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin JEONG
Abstract: An electronic component includes a magnetic body, and first and second internal coil parts embedded in the magnetic body spaced apart from each other and including coil conductors disposed on first and second surfaces of a support member.First and second spacer parts are disposed between the first and second internal coil parts in upper and lower portions of the magnetic body, respectively, with an interval therebetween.
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