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公开(公告)号：US20230358600A1
公开(公告)日：2023-11-09
申请号：US18353101
申请日：2023-07-16
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yongshuai YUAN , Wenbing ZHOU , Yujia HUANG
CPC classification number: G01H11/06 , H04R1/10 , H04R2460/13
Abstract: One or more embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a housing structure, an acoustic transducer, and a vibration unit. The acoustic transducer may be physically connected to the housing structure. An acoustic cavity may be formed at least partially by the housing structure and the acoustic transducer. The vibration unit may be configured to divide the acoustic cavity into a plurality of acoustic cavities. The plurality of acoustic cavities may include a first acoustic cavity. The first acoustic cavity may be in acoustic communication with the acoustic transducer. The vibration unit may include an elastic element and a mass element. The elastic element and the mass element may be located in the acoustic cavity, and the mass element may be connected to the housing structure or the acoustic transducer through the elastic element.
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公开(公告)号：US20230319458A1
公开(公告)日：2023-10-05
申请号：US18329597
申请日：2023-06-06
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Xin QI , Fengyun LIAO
Abstract: An embodiment of the present disclosure provides a vibration sensing device, which may include a vibration sensor and at least one vibration component. The vibration sensor has a first resonant frequency, at least one vibration component may be configured to transmit the received vibration to the vibration sensor, and the at least one vibration component may include a liquid arranged in the target cavity and a plate body forming a part of the cavity wall of the target cavity. The at least one vibration component may provide at least one second resonant frequency for the vibration sensing device, and at least one second resonant frequency may be different from the first resonant frequency.
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公开(公告)号：US20230288250A1
公开(公告)日：2023-09-14
申请号：US18320229
申请日：2023-05-19
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yongshuai YUAN , Wenjun DENG , Wenbing ZHOU , Yujia HUANG , Fengyun LIAO , Xin QI
Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.
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公开(公告)号：US20230213611A1
公开(公告)日：2023-07-06
申请号：US18054525
申请日：2022-11-10
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Le XIAO , Yongshuai YUAN , Yujia HUANG , Fengyun LIAO , Xin QI
IPC: G01S5/22
CPC classification number: G01S5/22
Abstract: Some embodiments of the present disclosure provide a method for locating a vibration signal source. The method may include obtaining sensing signals of at least two vibration sensing devices located at different locations, each of the sensing signals being generated by one of the at least two vibration sensing devices by sensing a vibration signal generated by a vibration, which is from the same vibration signal source; determining, based on the sensing signals, a time difference between time points when the at least two vibration sensing devices located at different locations receive the vibration signal; and determining, based on the time difference, a location of the vibration signal source.
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公开(公告)号：US20250097622A1
公开(公告)日：2025-03-20
申请号：US18963742
申请日：2024-11-28
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Wenbing ZHOU , Fengyun LIAO , Xin QI
Abstract: Disclosed is an earphone including: two speaker assemblies, a connection member, and a processing circuit. The connection member is configured to connect the two speaker assemblies, and the connection member provides, through a bending deformation, a clamping force for placing the two speaker assemblies on a head of a user, and the connection member includes a housing with an accommodation cavity. A bending sensor is disposed in the accommodating cavity, and the bending sensor is configured to generate a bending signal based on a bending state of the connection member. The processing circuit is configured to determine a placement state of the earphone based on the bending signal. The placement state includes one of a normal wearing state, an abnormal wearing state, or a free placement state.
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Patent Agency Ranking
公开(公告)号：US20250088814A1
公开(公告)日：2025-03-13
申请号：US18957926
申请日：2024-11-25
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yujia HUANG , Yongshuai YUAN , Wenbing ZHOU , Fengyun LIAO , Xin QI
Abstract: Embodiments of the present disclosure provide an acoustic output device, comprising: an acoustic output unit, a contact detection sensor, and a processor. The acoustic output unit includes a vibration unit and a casing, the casing at least including a contact region which is in contact with the face of a user; the contact detection sensor is located at the contact region; and the processor is configured to determine whether the user wears the acoustic output device based on an electrical signal generated when the contact detection sensor is in contact with the face of the user.
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公开(公告)号：US20250067549A1
公开(公告)日：2025-02-27
申请号：US18945486
申请日：2024-11-12
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Wenbing ZHOU , Fengyun LIAO , Xin QI
Abstract: The embodiments of the present disclosure provide a sensor device. The sensor device comprises a sensitive element and a substrate. The substrate is configured to carry the sensitive element. The sensitive element includes a first conductive layer and a sensitive layer. The first conductive layer includes at least two conductive units. The at least two conductive units are arranged in a distributed manner. At least a portion of the sensitive layer is disposed between and in contact with the at least two conductive units. A resistance value of the sensitive element changes in response to bending of the sensor device.
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公开(公告)号：US20250060208A1
公开(公告)日：2025-02-20
申请号：US18935631
申请日：2024-11-03
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yujia HUANG , Wenjun DENG , Yongshuai YUAN , Wenbing ZHOU , Fengyun LIAO , Xin QI
IPC: G01B7/16
Abstract: The embodiments of the present disclosure provide a conductive structure and a flexible sensor having the same. The conductive structure comprises a substrate, including an accommodation groove; a solid conductor, at least partially accommodated in the accommodation groove, the solid conductor and the accommodation groove forming a first accommodation region; and a fluid conductor, filled in the first accommodation region and extending outside the accommodation groove, a projection of a contact region between the fluid conductor and the solid conductor along a depth direction of the accommodation groove and a projection of the solid conductor along the depth direction having an overlapping region. The flexible sensor comprises at least one sensing structure. Each sensing structure includes two electrode plates; and a dielectric flexible body. The flexible sensor further comprises a processor. Each of the two electrodes includes the conductive structure.
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公开(公告)号：US20230362524A1
公开(公告)日：2023-11-09
申请号：US18351480
申请日：2023-07-12
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yongshuai YUAN , Wenjun DENG , Wenbing ZHOU , Yujia HUANG , Fengyun LIAO , Xin QI
IPC: H04R1/08
CPC classification number: H04R1/08
Abstract: The embodiments of the present disclosure provide a sensor device, including: a sensor assembly with a first resonant frequency and a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity may be formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly may change a sound pressure in the acoustic cavity, and the sensor assembly may convert the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly may provide the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency may be in a range of 1000 Hz-10000 Hz.
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公开(公告)号：US20230345170A1
公开(公告)日：2023-10-26
申请号：US18344810
申请日：2023-06-29
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Yujia HUANG , Yongshuai YUAN , Wenjun DENG , Xin QI , Fengyun LIAO
CPC classification number: H04R1/2807 , H04R1/08
Abstract: The present disclosure provides a microphone comprising: an acoustoelectric transducer configured to convert an sound signal to an electrical signal; an acoustic structure, the acoustic structure comprising a sound guiding tube and an acoustic cavity, the acoustic cavity being acoustically communicated with the acoustoelectric transducer and acoustically communicated with the outside of the microphone through the sound guiding tube; wherein the acoustic structure has a first resonant frequency, the acoustoelectric transducer has a second resonant frequency, and an absolute value of the difference between the first resonant frequency and the second resonant frequency is not greater than 1000 Hz.
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