公开(公告)号：US20210043780A1

公开(公告)日：2021-02-11

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  H01L31/12 ,  H01L33/48 ,  H01L31/18 ,  B29C45/14 ,  H01L31/02 ,  H01L31/0232 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20200258850A1

公开(公告)日：2020-08-13

申请号：US16862002

申请日：2020-04-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Marika SORRIEUL

IPC: H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L27/146 ,  H01L23/31 ,  H01L21/56

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US20200096720A1

公开(公告)日：2020-03-26

申请号：US16573023

申请日：2019-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Nicolas MASTROMAURO ,  Roy DUFFY ,  Karine SAXOD

IPC: G02B7/00 ,  H03H9/05 ,  H03H9/10

Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

公开(公告)号：US20190139947A1

公开(公告)日：2019-05-09

申请号：US16182315

申请日：2018-11-06

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Jean-Michel RIVIERE

IPC: H01L25/16 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/167 ,  H01L31/18 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  B29C45/14 ,  B29C69/00

Abstract: An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.