公开(公告)号：US20200020815A1

公开(公告)日：2020-01-16

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  B29C45/14 ,  H01L31/12 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20210043780A1

公开(公告)日：2021-02-11

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  H01L31/12 ,  H01L33/48 ,  H01L31/18 ,  B29C45/14 ,  H01L31/02 ,  H01L31/0232 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20190252212A1

公开(公告)日：2019-08-15

申请号：US16394925

申请日：2019-04-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit BESANCON ,  Alexandre MAS ,  Karine SAXOD

IPC: H01L21/56 ,  H01L23/552 ,  H01L23/053 ,  H01L21/48 ,  H01L23/04 ,  H01L23/31 ,  H01L23/06 ,  H01L23/10 ,  H01L21/52 ,  H01L23/433 ,  H01L23/42 ,  H01L23/24

CPC classification number: H01L21/565 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/315 ,  H01L23/3192 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.