公开(公告)号：US20200020815A1

公开(公告)日：2020-01-16

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  B29C45/14 ,  H01L31/12 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20210043780A1

公开(公告)日：2021-02-11

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  H01L31/12 ,  H01L33/48 ,  H01L31/18 ,  B29C45/14 ,  H01L31/02 ,  H01L31/0232 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.