公开(公告)号：US09754851B2

公开(公告)日：2017-09-05

申请号：US15050253

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/3105 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L21/3105 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.