公开(公告)号：US20210099154A1

公开(公告)日：2021-04-01

申请号：US17031181

申请日：2020-09-24

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Federico VERCESI ,  Lorenzo CORSO ,  Giorgio ALLEGATO ,  Gabriele GATTERE

IPC: H03H9/10 ,  B81B7/00 ,  B81C1/00 ,  H03H3/02 ,  H03H9/17

Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.

公开(公告)号：US20190239000A1

公开(公告)日：2019-08-01

申请号：US16256816

申请日：2019-01-24

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Federico VERCESI ,  Laura Maria CASTOLDI ,  Laura OGGIONI ,  Matteo PERLETTI

IPC: H04R19/04 ,  B81C1/00

CPC classification number: H04R19/04 ,  B81C1/00309 ,  B81C2201/0133 ,  H04R1/021 ,  H04R1/086 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.