公开(公告)号：US20210188620A1

公开(公告)日：2021-06-24

申请号：US17126903

申请日：2020-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Nicolo' BONI ,  Laura OGGIONI ,  Roberto CARMINATI ,  Marta CARMINATI

IPC: B81B3/00 ,  B81C1/00

Abstract: For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

公开(公告)号：US20170369309A1

公开(公告)日：2017-12-28

申请号：US15379091

申请日：2016-12-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Laura OGGIONI ,  Matteo GARAVAGLIA ,  Roberto SOMASCHINI

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00269 ,  B81B3/0097 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/042 ,  B81B2203/0315 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/037

Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.

公开(公告)号：US20220380203A1

公开(公告)日：2022-12-01

申请号：US17744312

申请日：2022-05-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Federico VERCESI ,  Luca SEGHIZZI ,  Laura OGGIONI ,  Lorenzo CORSO

IPC: B81B7/02 ,  B81B7/00

Abstract: A process for manufacturing a combined microelectromechanical device includes forming, in a die of semiconductor material, at least a first and a second microelectromechanical structure, performing a first bonding phase to bond a cap to the die via a bonding region or adhesive to define at least a first and a second cavity at the first and, respectively, second microelectromechanical structures, the cavities being at a controlled pressure, forming an access channel through the cap in fluidic communication with the first cavity to control the pressure value inside the first cavity in a distinct manner with respect to a respective pressure value inside the second cavity, and performing a second bonding phase, after which the bonding region deforms to hermetically close the first cavity with respect to the access channel.

公开(公告)号：US20190239000A1

公开(公告)日：2019-08-01

申请号：US16256816

申请日：2019-01-24

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Federico VERCESI ,  Laura Maria CASTOLDI ,  Laura OGGIONI ,  Matteo PERLETTI

IPC: H04R19/04 ,  B81C1/00

CPC classification number: H04R19/04 ,  B81C1/00309 ,  B81C2201/0133 ,  H04R1/021 ,  H04R1/086 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.

公开(公告)号：US20240043263A1

公开(公告)日：2024-02-08

申请号：US18244479

申请日：2023-09-11

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Nicolo' BONI ,  Laura OGGIONI ,  Roberto CARMINATI ,  Marta CARMINATI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/0069 ,  B81C2201/013 ,  B81C2201/0156

Abstract: A method for manufacturing an optical microelectromechanical device, includes forming, in a first wafer of semiconductor material having a first surface and a second surface, a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements extending between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. The method continues with forming, in a second wafer, a chamber delimited by a bottom wall having a through opening, and bonding the second wafer to the first surface of the first wafer and bonding a third wafer to the second surface of the first wafer so that the chamber overlies the actuation structure, and the through opening is aligned to the suspended mirror structure, thus forming a device composite wafer. The device composite wafer is diced to form an optical microelectromechanical device.

公开(公告)号：US20220350134A1

公开(公告)日：2022-11-03

申请号：US17729558

申请日：2022-04-26

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto CARMINATI ,  Nicolo' BONI ,  Irene MARTINI ,  Massimiliano MERLI ,  Laura OGGIONI

IPC: G02B26/08 ,  B81B7/02 ,  B81C1/00 ,  H01L41/09

Abstract: A process for manufacturing a microelectromechanical mirror device includes, in a semiconductor wafer, defining a support frame, a plate connected to the support frame so as to be orientable around at least one rotation axis, and cantilever structures extending from the support frame and coupled to the plate so that bending of the cantilever structures causes rotations of the plate around the at least one rotation axis. The process further includes forming piezoelectric actuators on the cantilever structures, forming pads on the support frame, and forming spacer structures protruding from the support frame more than both the pads and the stacks of layers forming the piezoelectric actuators.