公开(公告)号：US20150062872A1

公开(公告)日：2015-03-05

申请号：US14249231

申请日：2014-04-09

Applicant: Samsung Display Co., Ltd.

Inventor： Hee Kwang SONG ,  Kang Woo LEE ,  Seok Hyun NAM ,  Ju Young YOON ,  Kwang Wook CHOI

IPC: F21V5/04 ,  F21V9/08

CPC classification number: G02F1/133603 ,  G02B5/021 ,  G02B5/0221 ,  G02B5/0289 ,  G02B19/0028 ,  G02B19/0061 ,  G02F2001/133607

Abstract: Provided are a light source assembly and a backlight assembly including a lens module. The light source assembly includes: a light source module capable of emitting light and a lens module positioned on the light source module. The lens module includes a light collecting lens collecting the light emitted from the light source module, and a diffusion lens positioned on the light collecting lens, and including an inner curved surface in which light from the light collecting lens is incident and an outer curved surface where the light incident on the inner curved surface exits the diffusion lens, and the light emitted from the light source module forms a light collecting region on the inner curved surface by passing through the light collecting lens.

Abstract translation: 提供了一种光源组件和包括透镜模块的背光组件。 光源组件包括：能够发光的光源模块和位于光源模块上的透镜模块。 透镜模块包括：聚光透镜，其收集从光源模块发出的光;以及扩散透镜，位于集光透镜上，并且包括内弯曲表面，其中来自聚光透镜的光入射，内弯曲表面 其中入射在内曲面上的光离开扩散透镜，并且从光源模块发出的光通过聚光透镜在内弯曲表面上形成聚光区域。

公开(公告)号：US20250048861A1

公开(公告)日：2025-02-06

申请号：US18594543

申请日：2024-03-04

Applicant: Samsung Display Co., LTD.

Inventor： Si Joon SONG ,  Youn Woong KANG ,  Eui Jeong KANG ,  Min Sang KOO ,  Tae Oh KIM ,  Seok Hyun NAM ,  Jeong Jin PARK ,  Dong Hyun LEE ,  Jae Hak LEE

IPC: H10K59/131 ,  H10K59/12 ,  H10K59/123 ,  H10K59/127 ,  H10K71/60

Abstract: A display device includes a first substrate including an open portion, a first barrier insulating layer disposed on the first substrate and including a first contact hole overlapping the open portion, a first fan-out line disposed on the first barrier insulating layer, a pad part integrally formed with the first fan-out line and exposed through the open portion, a second substrate disposed on the first fan-out line, a connection part disposed on the second substrate and connected to the first fan-out line, a second fan-out line disposed on a layer between the first fan-out line and the connection part and connected to the connection part, a data line disposed on the same layer as the connection part and electrically connected to the second fan-out line, a flexible film including a lead electrode, and a contact part electrically connecting the lead electrode and the pad part.

公开(公告)号：US20180284541A1

公开(公告)日：2018-10-04

申请号：US15918593

申请日：2018-03-12

Applicant: Samsung Display Co. Ltd.

Inventor： Eui Jeong KANG ,  Young Chun KIM ,  Seok Hyun NAM

IPC: G02F1/1335

Abstract: A display device includes a display panel, and a backlight unit which provides first light to the display panel, the first light being a combination of light having a first peak wavelength and light having a second peak wavelength. The display panel includes a wavelength conversion layer which converts a peak wavelength of the first light. The backlight unit includes laser diodes emitting the light having the second peak wavelength, and where the wavelength conversion layer includes quantum dots or phosphor.

公开(公告)号：US20150219966A1

公开(公告)日：2015-08-06

申请号：US14283917

申请日：2014-05-21

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Si Joon SONG ,  Hyuk Hwan KIM ,  Hyun Jeong KIM ,  Seok Hyun NAM ,  Young Keun LEE

IPC: G02F1/1335 ,  F21V7/00 ,  F21V7/04 ,  F21V5/04 ,  F21V13/04 ,  F21V23/00

CPC classification number: G02F1/133611 ,  F21V5/046 ,  F21V7/0066 ,  F21V7/04 ,  F21V13/04 ,  F21V23/004 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133607 ,  H05K1/0274 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/2054

Abstract: A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.

Abstract translation: 光源模块包括印刷电路板，其包括布线层，设置在布线层上的绝缘涂层，以及布置在绝缘涂层上并具有与绝缘涂层的反射特性不同的反射特性的反射调节图案 ，安装在印刷电路板上的发光芯片，以及配置在发光芯片的上部并固定在印刷电路板上的光学透镜。

公开(公告)号：US20150219288A1

公开(公告)日：2015-08-06

申请号：US14306127

申请日：2014-06-16

Applicant: Samsung Display Co., Ltd.

Inventor： Jae Sul AN ,  Seok Hyun NAM ,  Sang Hyuck YOON ,  Yeong Bae LEE

IPC: F21K99/00

CPC classification number: F21K9/90 ,  H01L33/44 ,  H01L33/502 ,  H01L33/507 ,  H01L33/644

Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

Abstract translation: 提供一种发光二极管（LED）封装及其制造方法。 LED封装包括封装模具，位于封装模具表面上的LED芯片和位于封装模具表面上并与LED芯片分离的波长转换器。 波长转换器包括位于封装模具表面上的第一阻挡层，位于第一阻挡层上的波长转换层和位于波长转换层上的第二阻挡层。

公开(公告)号：US20150138827A1

公开(公告)日：2015-05-21

申请号：US14262438

申请日：2014-04-25

Applicant: Samsung Display Co., Ltd.

Inventor： Si Joon SONG ,  Hyuk Hwan KIM ,  Seok Hyun NAM ,  Byoung Dae YE ,  Young Keun LEE

IPC: H01L23/60 ,  F21V8/00 ,  H01L25/16 ,  G02F1/1335 ,  H01L33/62 ,  H01L23/552

CPC classification number: H01L25/167 ,  G02B6/0073 ,  G02B6/0083 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

Abstract translation: 提供了当LED芯片被容纳在发光二极管壳体封装（LED封装）中并且LED封装安装在印刷电路板上时，保护LED芯片免受ESD和EMI损坏的方法。 该方法包括在印刷电路板和LED封装的组合中不包括ESD和EMI抑制齐纳二极管的步骤，并且在印刷电路板和LED封装的组合内提供第一导电构件和间隔开的步骤 第二导电构件，其电连接到LED芯片，并且在它们之间限定至少一个绝缘ESD和/或EMI抑制区域，当经受大于预定阈值电压的绝对值的电压时，其绝缘性能分解。