DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY DEVICE

    公开(公告)号:US20240155926A1

    公开(公告)日:2024-05-09

    申请号:US18358181

    申请日:2023-07-25

    CPC classification number: H10K59/8792 H10K59/1201 H10K59/131 H10K59/18

    Abstract: A display device of a tiled display includes a first substrate including an opening hole, a laser absorption layer disposed on the first substrate, including amorphous silicon, and multiple first contact holes, a first barrier insulating layer disposed on the laser absorption layer and including multiple second contact holes overlapping the first contact holes, multiple pad portions disposed on the first barrier insulating layer and partially disposed in the second contact holes, a second barrier insulating layer disposed on the first barrier insulating layer and the pad portions, a display layer disposed on the second barrier insulating layer, and a flexible film disposed under the first substrate, inserted into the opening hole, and electrically connected to the pad portions. A portion of the first barrier insulating layer is disposed in each of the first contact holes. The pad portions are electrically insulated from the laser absorption layer.

    DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210217986A1

    公开(公告)日:2021-07-15

    申请号:US17107705

    申请日:2020-11-30

    Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

    DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210280814A1

    公开(公告)日:2021-09-09

    申请号:US17062245

    申请日:2020-10-02

    Abstract: A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.

    DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210249627A1

    公开(公告)日:2021-08-12

    申请号:US17012115

    申请日:2020-09-04

    Abstract: A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.

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