公开(公告)号：US20180211933A1

公开(公告)日：2018-07-26

申请号：US15878835

申请日：2018-01-24

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwa HA ,  Seung Soo RYU ,  Jeong Ho HWANG

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/683

Abstract: A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.

公开(公告)号：US20180114768A1

公开(公告)日：2018-04-26

申请号：US15787609

申请日：2017-10-18

Applicant: Samsung Display Co., Ltd.

Inventor： Sang Hyeon SONG ,  Seung Hwa HA ,  Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L23/293 ,  H01L23/296 ,  H01L23/31 ,  H01L23/3171 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81206 ,  H01L2224/8183

Abstract: Provided herein may be an electronic device. The electronic device may include a substrate provided with a plurality of connecting pads including a first metal, a semiconductor chip on an area of the substrate, facing the connecting pads, and including a base substrate including a first surface facing the substrate, and a second surface opposite the first surface, a plurality of connecting terminals on the first surface, facing the connecting pads, and including a second metal, and a non-adhesive polymer layer on the second surface, and a conductive joining layer electrically connecting, and interposed between, respective ones of the connecting pads to the connecting terminals, and including a diffusion layer in which the first metal and the second metal are mixed.