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公开(公告)号：US20180034002A1
公开(公告)日：2018-02-01
申请号：US15658597
申请日：2017-07-25
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Byoung Yong KIM , Jeong Ho HWANG
Abstract: A display device includes a substrate including a display area and a peripheral area outside the display area, the peripheral area including a bendable bending region, a display member on the display area of the substrate to display an image, and a protection film under the substrate, the protection film including a groove at a position corresponding to the bending region of the peripheral area, wherein the groove includes a bottom surface and inner walls extending from the bottom surface to a surface of the protection film, a boundary part being defined at an intersection of each inner wall with the surface of the protection film, and wherein boundary parts adjacent to opposite ends of the protection film are separated from the opposite ends of the protection film, respectively.
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公开(公告)号：US20170358520A1
公开(公告)日：2017-12-14
申请号：US15600849
申请日：2017-05-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Sang Hyeon SONG , Byoung Yong KIM , Jeong Ho HWANG
IPC: H01L23/498 , G02F1/133 , G09G3/3208 , H01L23/495
Abstract: A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.
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公开(公告)号：US20210134756A1
公开(公告)日：2021-05-06
申请号：US17149888
申请日：2021-01-15
Applicant: Samsung Display Co. Ltd.
Inventor： Byoung Yong KIM , Jeong Ho HWANG
Abstract: A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.
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公开(公告)号：US20180174952A1
公开(公告)日：2018-06-21
申请号：US15827382
申请日：2017-11-30
Applicant: Samsung Display Co., Ltd.
Inventor： Byoung Yong KIM , Jong Hyuk LEE , Jeong Ho HWANG
IPC: H01L23/498 , H01L23/00 , H05K1/02 , H05K5/00
Abstract: A substrate includes a base substrate, and a pad at one side of the base substrate, wherein the pad comprises: a first conductive pattern on the base substrate, an insulating layer including a plurality of contact holes exposing a portion of the first conductive pattern, and second conductive patterns separately on the insulating layer and connected to the first conductive pattern through the plurality of contact holes, wherein side surfaces of the second conductive patterns are exposed.
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公开(公告)号：US20180074556A1
公开(公告)日：2018-03-15
申请号：US15679503
申请日：2017-08-17
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Seung Chan LEE , Jong Deok PARK , Byung Wook AHN , Ki Kyung YOUK , Jee Hun LIM , Suk Won JUNG , Won Joon CHOI , Jeong Ho HWANG
CPC classification number: G06F1/1656 , G02F1/13 , G06F1/1601 , G06F1/1652 , G06F3/041 , G06F2203/04102 , H05K7/20963 , H05K9/0054
Abstract: A cover panel and a display device, the cover panel including a heat sink layer; an impact absorbing layer on the heat sink layer; and an elastic pattern on at least one side of the impact absorbing layer.
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Patent Agency Ranking
公开(公告)号：US20180068931A1
公开(公告)日：2018-03-08
申请号：US15685640
申请日：2017-08-24
Applicant: Samsung Display Co., Ltd.
Inventor： Seung Hwa HA , Jung Yun JO , Byoung Yong KIM , Jeong Do YANG , Jeong Ho HWANG
IPC: H01L23/495 , H01L23/00 , H01L23/498
CPC classification number: H01L23/4952 , H01L23/49816 , H01L24/10 , H01L24/12 , H01L24/13 , H01L2224/0401 , H01L2224/05572 , H01L2224/13019
Abstract: A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.
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公开(公告)号：US20180014405A1
公开(公告)日：2018-01-11
申请号：US15641686
申请日：2017-07-05
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： BYOUNG YONG KIM , Jeong Ho HWANG , Jong Hyuk LEE
CPC classification number: H05K1/111 , H01L24/06 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/06135 , H01L2224/06153 , H01L2224/06155 , H01L2224/06177 , H01L2224/16227 , H01L2224/29499 , H01L2224/32227 , H01L2224/73204 , H01L2224/81193 , H01L2224/81194 , H05K1/181 , H05K2201/09227 , H05K2201/09409 , H05K2201/09418 , H05K2201/10128 , Y02P70/611
Abstract: A display device includes a display substrate including a display area where an image is displayed and a pad area disposed at a periphery of the display area, and a first pad portion disposed in the pad area, the first pad portion including a plurality of first line pad terminals arranged along a first curved line in a first direction.
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8.发明申请公开(公告)号：US20210245925A1
公开(公告)日：2021-08-12
申请号：US17141617
申请日：2021-01-05
Applicant: Samsung Display Co., Ltd.
Inventor： Sangwon LEE , Jeong Ho HWANG
Abstract: A tray for a display apparatus includes a plate disposed to be parallel with a first direction and a second direction perpendicular to the first direction, a first recessed part recessed from the plate in a third direction perpendicular to the first and second directions, a second recessed part recessed from the plate in the third direction and spaced apart from the first recessed part in the second direction, a first inclined surface extending from the first recessed part in a direction opposite to the third direction and inclined at a first angle with respect to the plate, and a second inclined surface extending from the second recessed part in the direction opposite to the third direction, inclined at a second angle with respect to the plate and connected to the first inclined surface.
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公开(公告)号：US20190181388A1
公开(公告)日：2019-06-13
申请号：US16132981
申请日：2018-09-17
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Byoung Yong KIM , Jeong Ho HWANG
Abstract: A display device includes a flexible base layer including a first portion and a second portion. A display unit is disposed on a first surface of the first portion. The display unit includes a light emitting element. A driving circuit is disposed on a first surface of the second portion. The driving circuit includes a driving chip. A first support member is disposed on a second surface of the first portion opposite the first surface. A second support member is disposed on a second surface of the second portion. The second support member includes a first opening overlapping the driving circuit. The second surface of the second portion is on an opposite side of the second portion from the first surface of the second portion. A first reinforcing member is disposed in the first opening. The first reinforcing member includes a different material from the second support member.
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公开(公告)号：US20180211933A1
公开(公告)日：2018-07-26
申请号：US15878835
申请日：2018-01-24
Applicant: Samsung Display Co., Ltd.
Inventor： Seung Hwa HA , Seung Soo RYU , Jeong Ho HWANG
IPC: H01L23/00 , H01L21/67 , H01L21/683
Abstract: A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.
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