公开(公告)号：US11967597B2

公开(公告)日：2024-04-23

申请号：US17391036

申请日：2021-08-02

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L23/00 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/11 ,  H05K1/18 ,  H10K59/131

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H05K1/111 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  H10K59/131 ,  Y02P70/50 ,  Y10T29/49005

Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

公开(公告)号：US11495591B2

公开(公告)日：2022-11-08

申请号：US17191561

申请日：2021-03-03

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee ,  Kyung Mok Lee ,  Suk Ho Choi

IPC: H01L25/18 ,  H01L23/00 ,  H01L27/32 ,  H01L51/00

Abstract: The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.

公开(公告)号：US20170154899A1

公开(公告)日：2017-06-01

申请号：US15429411

申请日：2017-02-10

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L27/12 ,  H01L23/00

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

公开(公告)号：US09142602B2

公开(公告)日：2015-09-22

申请号：US14265737

申请日：2014-04-30

Applicant: Samsung Display Co., Ltd.

Inventor： Jin Sic Min ,  Dae Geun Lee ,  Sang Urn Lim ,  Eu Tteum Kim

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L27/3276 ,  H01L27/3255 ,  H01L51/524 ,  H01L51/529 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5369

Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

Abstract translation: 显示装置包括：基板，具有布线部，设置在基板上并从布线部延伸的焊盘单元，与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜， 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触，向各向异性导电膜供给热量。