公开(公告)号：US20200313279A1

公开(公告)日：2020-10-01

申请号：US16732762

申请日：2020-01-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Nam CHO ,  Sung Yong AN ,  Ji Hyung JUNG ,  Chin Mo KIM

IPC: H01Q1/22 ,  H01Q9/40 ,  H01Q1/38 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US20200259267A1

公开(公告)日：2020-08-13

申请号：US16670139

申请日：2019-10-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ju Hyoung PARK ,  Kyu Bum HAN ,  Jae Yeong KIM ,  Jeong Ki RYOO ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q19/10 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

公开(公告)号：US20190237861A1

公开(公告)日：2019-08-01

申请号：US16185118

申请日：2018-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Yong AN ,  Sang Jong LEE ,  Seong Hee CHOI ,  Kyu Bum HAN ,  Jeong Ki RYOO ,  Byeong Cheol MOON ,  Chang Hak CHOI

IPC: H01Q1/38 ,  H01Q15/14 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q15/14

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

公开(公告)号：US20190190120A1

公开(公告)日：2019-06-20

申请号：US16149440

申请日：2018-10-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Yong AN ,  Chang Hak CHOI

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q1/48 ,  H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q21/0025 ,  H01Q21/065

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

公开(公告)号：US20150002255A1

公开(公告)日：2015-01-01

申请号：US14317436

申请日：2014-06-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hak Kwan KIM ,  Sung Yong AN ,  Jae Yeong KIM ,  Jung Wook SEO

IPC: H01F27/255 ,  B22F3/00 ,  H01F1/20

CPC classification number: H01F27/255 ,  B22F1/0044 ,  B22F1/02 ,  B22F2998/10 ,  C22C33/02 ,  H01F1/15333 ,  H01F1/24 ,  H01F1/33 ,  B22F1/0003 ,  B22F2009/041 ,  B22F1/0059 ,  B22F3/22 ,  B22F2003/185 ,  B22F7/02

Abstract: Provided is a composite for manufacturing a chip part for a high frequency, and the composite includes a magnetic powder having a relatively spherical shape, and a metal magnetic body particle having a relatively more amorphous shape than that of the magnetic powder and a lower hardness than that of the magnetic powder.

Abstract translation: 本发明提供一种高频用芯片部件的制造用复合体，其特征在于，包括具有比较球形的磁性粉末和具有比磁性粉末更为非晶形状的金属磁性体粒子，硬度低于 磁粉粉末。

公开(公告)号：US20230112892A1

公开(公告)日：2023-04-13

申请号：US17861683

申请日：2022-07-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Youngjo CHOI ,  Chin Mo KIM ,  Jae Yeong KIM ,  Eun Ju OH

IPC: H01Q9/04 ,  H01Q1/42 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q1/22

Abstract: A chip patch antenna includes an upper dielectric layer including a first dielectric material and a second dielectric material having different dielectric constants from each other and bonded to each other in a planar direction, a first patch antenna electrode and a second patch antenna electrode respectively disposed on one side of each of the first dielectric material and the second dielectric material, a lower dielectric layer spaced from the first dielectric material and the second dielectric material in a thickness direction, and a third patch antenna electrode and a fourth patch antenna electrode disposed on one side of the lower dielectric layer.

公开(公告)号：US20210384633A1

公开(公告)日：2021-12-09

申请号：US17405286

申请日：2021-09-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US20210175612A1

公开(公告)日：2021-06-10

申请号：US17177512

申请日：2021-02-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Yong AN ,  Chang Hak CHOI

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q21/28 ,  H01Q21/06 ,  H01Q9/04

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

公开(公告)号：US20210143527A1

公开(公告)日：2021-05-13

申请号：US17151952

申请日：2021-01-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

公开(公告)号：US20210111478A1

公开(公告)日：2021-04-15

申请号：US16788585

申请日：2020-02-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Jae Yeong KIM ,  Sung Yong AN ,  Sung Nam CHO ,  Ji Hyung JUNG

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/42 ,  H01Q9/04

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).