公开(公告)号：US20210384096A1

公开(公告)日：2021-12-09

申请号：US17188332

申请日：2021-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghyun Lee ,  Juhyun Lyu ,  Unbyoung Kang ,  Chulwoo Kim ,  Jongho Lee

IPC: H01L23/36 ,  H01L25/065 ,  H01L23/40

Abstract: A semiconductor package includes a first semiconductor chip mounted on the package substrate, a second semiconductor mounted on the package substrate and set apart from the first semiconductor chip in a horizontal direction thereby forming a gap between the first semiconductor chip and the second semiconductor chip. The semiconductor package further includes a first thermal interface material layer formed in the gap and having a first modulus of elasticity and a second thermal interface material layer formed on each of the first semiconductor chip and the second semiconductor chip and having a second modulus of elasticity, wherein the first modulus of elasticity is less than the second modulus of elasticity.