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    Solid state drive apparatus
    26.
    发明授权
    Solid state drive apparatus 有权

    公开(公告)号：US10551885B2

    公开(公告)日：2020-02-04

    申请号：US16405557

    申请日：2019-05-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Hoon Kim

    IPC: G06F1/20

    Abstract: A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.

    Printed circuit board and solid state drive apparatus having the same
    27.
    发明授权
    Printed circuit board and solid state drive apparatus having the same 有权

    公开(公告)号：US10356891B2

    公开(公告)日：2019-07-16

    申请号：US15825856

    申请日：2017-11-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jung-Hoon Kim

    IPC: H05K7/00 ,  H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

    Abstract: A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.

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