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    Electronic device and method for controlling the electronic device
    1.
    发明授权
    Electronic device and method for controlling the electronic device 有权

    公开(公告)号：US10250820B2

    公开(公告)日：2019-04-02

    申请号：US15497576

    申请日：2017-04-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hong-Suk Choi ,  Jung-Hoon Kim ,  Ki-Huk Lee

    IPC: H04N5/265 ,  G06T7/11 ,  H04N5/225

    Abstract: An electronic device and a method for controlling thereof are provided. The device includes a light emitter, an image sensor including first pixels controlled based on a first parameter and second pixels controlled based on a second parameter, a sensor, and a processor. The processor detects a first object and a second object in an image area, determines the first and second parameters based on a first property of the first object and a second property of the second object, said determination is based on a light intensity that is outputted from the light emitter and reflected by the first and second objects, acquires a first image of the first object according to the first parameter and a second image of the second object according to the second parameter, and synthesizes a first area corresponding to the first object with a second area corresponding to the second object.

    Semiconductor device
    2.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US09504138B2

    公开(公告)日：2016-11-22

    申请号：US14446289

    申请日：2014-07-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Hoon Kim ,  Jin-Hyuk Lee

    IPC: H05K1/02 ,  H01L23/52 ,  H01L23/36 ,  H05K1/18

    CPC classification number: H05K1/0207 ,  H01L23/36 ,  H01L23/52 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.

    Abstract translation: 本发明构思的实施例包括具有电路板的半导体器件，该电路板包括第一外层，第一外层中的接触区域，形成在第一外层的相对侧上的第二层，通孔和多个 的内层被形成为堆叠在第一层和第二层之间。 一个案例可以容纳电路板。 壳体可以具有突出部分，其被配置为在接触区域中与电路板接触。 多个内层可以包括接地层。 第一外层可以通过通孔连接到接地层。 壳体可以通过第一外层连接到接地层。

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