公开(公告)号：US20240006325A1

公开(公告)日：2024-01-04

申请号：US18367039

申请日：2023-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Youngchan KO ,  Taesung JEONG

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/5383 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/20 ,  H01L21/4857 ,  H01L21/4853 ,  H01L23/3107 ,  H01L21/486 ,  H01L2224/214 ,  H01L2224/211

Abstract: A semiconductor package and associated methods, the package including a substrate; first and second semiconductor chips on the substrate; and external terminals below the substrate, wherein the substrate includes a core portion; first and second buildup portions on top and bottom surfaces of the core portion, the first and second buildup portions including a dielectric pattern and a line pattern; and an interposer chip in an embedding region in the core portion and electrically connected to the first and second buildup portions, the interposer chip includes a base layer; a redistribution layer on the base layer; and a via that penetrates the base layer, the via being connected to the redistribution layer and exposed at a surface of the base layer, the redistribution layer is connected to a line pattern of the first buildup portion, and the via is connected to a line pattern of the second buildup portion.

公开(公告)号：US20230016061A1

公开(公告)日：2023-01-19

申请号：US17721745

申请日：2022-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon LEE ,  Myungsam KANG ,  Youngchan KO

IPC: H01L25/16 ,  H01L23/053 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L23/538 ,  H01L23/66

Abstract: A semiconductor package includes an antenna structure including an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via; a frame surrounding the side surface of the antenna structure; a first encapsulant covering at least a portion of the antenna structure and the frame; a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor configured to be electrically connected to the ground member and the connection via in the insulating layer; a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor; a second encapsulant encapsulating the first semiconductor chip on the redistribution structure; and a shielding layer surrounding a surface of the second encapsulant.

公开(公告)号：US20220059440A1

公开(公告)日：2022-02-24

申请号：US17228784

申请日：2021-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Youngchan KO ,  Jeongseok KIM ,  Kyung Don MUN ,  Bongju CHO

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a redistribution substrate having a dielectric layer and a wiring pattern in the dielectric layer, the wiring pattern including a line part that extends horizontally, and a via part connected to the line part, the via part having a width less than a width of the line part, a passivation layer on a top surface of the redistribution substrate, the passivation layer including a material different from a material of the dielectric layer, a conductive pillar that penetrates the passivation layer, the conductive pillar being connected to the via part, and a connection terminal on a top surface of the conductive pillar, a distance between the top surface of the conductive pillar and a top surface of the passivation layer being greater than a thickness of the passivation layer.

公开(公告)号：US20220013454A1

公开(公告)日：2022-01-13

申请号：US17149216

申请日：2021-01-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Youngchan KO ,  Jeongseok KIM ,  Bongju CHO

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L23/532

Abstract: A semiconductor package includes: a first redistribution structure having a first surface and a second surface opposing the first surface, and including a first insulating layer and a first redistribution layer disposed on the first insulating layer; a semiconductor chip disposed on the first surface of the first redistribution structure, and including a connection pad electrically connected to the first redistribution layer and embedded in the first insulating layer; a vertical connection structure disposed on the first surface and electrically connected to the first redistribution layer; an encapsulant encapsulating at least a portion of each of the semiconductor chip and the vertical connection structure; a second redistribution structure disposed on the encapsulant and including a second redistribution layer electrically connected to the vertical connection structure; and a connection bump disposed on the second surface and electrically connected to the first redistribution layer.

公开(公告)号：US20200312797A1

公开(公告)日：2020-10-01

申请号：US16703279

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Changbae LEE ,  Bongju CHO ,  Younggwan KO ,  Yongkoon LEE ,  Moonil KIM ,  Youngchan KO

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00

Abstract: A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.