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    Microelectronic package having stacked semiconductor devices and a process for its fabrication
    23.
    发明申请
    Microelectronic package having stacked semiconductor devices and a process for its fabrication 有权
    具有堆叠半导体器件的微电子封装及其制造工艺

    公开(公告)号：US20060138647A1

    公开(公告)日：2006-06-29

    申请号：US11021627

    申请日：2004-12-23

    申请人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

    发明人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

    IPC分类号： H01L23/34 ,  H01L23/48

    CPC分类号： H01L24/73 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.

    摘要翻译： 具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。 导电柱从第一微电子元件的一个主表面延伸。 第一微电子元件经由导电柱与第二微电子元件电互连。 第一微电子元件优选地具有导电柱延伸的插入元件。 第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。 如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。 封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。 焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。