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    Microelectronic package having stacked semiconductor devices and a process for its fabrication
    4.
    发明申请
    Microelectronic package having stacked semiconductor devices and a process for its fabrication 有权
    具有堆叠半导体器件的微电子封装及其制造工艺

    公开(公告)号：US20060138647A1

    公开(公告)日：2006-06-29

    申请号：US11021627

    申请日：2004-12-23

    申请人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

    发明人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

    IPC分类号： H01L23/34 ,  H01L23/48

    CPC分类号： H01L24/73 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.

    摘要翻译： 具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。 导电柱从第一微电子元件的一个主表面延伸。 第一微电子元件经由导电柱与第二微电子元件电互连。 第一微电子元件优选地具有导电柱延伸的插入元件。 第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。 如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。 封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。 焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。

    Solder ball formation and transfer method
    5.
    发明申请
    Solder ball formation and transfer method 审中-公开
    焊球形成和转移方法

    公开(公告)号：US20060108402A1

    公开(公告)日：2006-05-25

    申请号：US10993962

    申请日：2004-11-19

    申请人： Richard Crisp ,  Giles Humpston

    发明人： Richard Crisp ,  Giles Humpston

    IPC分类号： B23K31/02

    CPC分类号： H01L21/6835 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H05K3/3484 ,  H05K2203/0338 ,  H05K2203/043

    摘要： A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the solder mass from the first substrate to a second substrate.

    摘要翻译： 一种形成和施加焊料块的方法，所述焊料质量包括将包含载体和焊料的焊膏沉积到第一衬底上，所述焊料不能被所述焊料润湿; 在第一基板上回流焊膏以使焊料聚结成焊料; 以及将所述焊料块从所述第一基板转移到第二基板。

    Modular Server handle
    7.
    发明授权
    Modular Server handle 有权
    模块化服务器句柄

    公开(公告)号：US07576979B1

    公开(公告)日：2009-08-18

    申请号：US12117971

    申请日：2008-05-09

    申请人： Timothy C. Dearborn ,  George Hoh ,  Brandon Joel Brocklesby ,  Scott Lauffer ,  Richard Crisp ,  Paul Kramer

    发明人： Timothy C. Dearborn ,  George Hoh ,  Brandon Joel Brocklesby ,  Scott Lauffer ,  Richard Crisp ,  Paul Kramer

    IPC分类号： G06F1/16

    CPC分类号： G06F1/181 ,  H05K7/1487 ,  H05K7/1489

    摘要： An improved modular server handle mechanism. The handle mechanism provides a translating handle mechanism that does not visibly function like a cam lever, and provides a carry handle solution when transporting the blade. In operation, to remove a blade server, a user pushes a button that releases the handle from a locked position. The handle is then pulled, and the cam levers undock the blade module from the chassis. When the cam motion is complete, the handle “locks out” in an open position to provide a carry handle.

    摘要翻译： 改进的模块化服务器句柄机制。 手柄机构提供了不像凸轮杆那样明显地起作用的平移手柄机构，并且在运送叶片时提供了手柄解决方案。 在操作中，要删除刀片服务器，用户将释放手柄的按钮从锁定位置推开。 然后拉出手柄，并且凸轮杆将刀片模块从机箱上拆下。 当凸轮运动完成时，手柄“锁定”在打开位置以提供进位手柄。