Adjuvant for chemical mechanical polishing slurry
    23.
    发明授权
    Adjuvant for chemical mechanical polishing slurry 有权
    化学机械抛光浆辅料

    公开(公告)号:US07674716B2

    公开(公告)日:2010-03-09

    申请号:US11319071

    申请日:2005-12-28

    IPC分类号: H01L21/302

    摘要: Disclosed is an adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material to cationically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing: (a) a graft type polyelectrolyte that has a weight average molecular weight of 1,000˜20,000 and comprises a backbone and a side chain; and (b) a basic material. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.

    摘要翻译: 公开了一种用于同时抛光阳离子充电材料和阴离子充电材料的佐剂,其在阳离子充电材料上形成吸附层,以增加阴离子充电材料对阳离子电荷材料的抛光选择性,其中佐剂 包括聚电解质盐,其包含:(a)重均分子量为1,000〜20,000的接枝型聚电解质,其包含骨架和侧链; 和(b)基本材料。 还公开了包含上述助剂和磨料颗粒的CMP(化学机械抛光)浆料。