公开(公告)号：US20060183328A1

公开(公告)日：2006-08-17

申请号：US11203269

申请日：2005-08-12

申请人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

发明人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

IPC分类号： C25D3/38 ,  H01L21/44

CPC分类号： C25D3/38 ,  H01L21/2885 ,  H05K3/423

摘要： The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

公开(公告)号：US20060166565A1

公开(公告)日：2006-07-27

申请号：US11146638

申请日：2005-06-07

申请人： Stephane Menard ,  Jun Lu

发明人： Stephane Menard ,  Jun Lu

IPC分类号： H01R4/72

CPC分类号： H01R4/183

摘要： The collapsing bridge crimp comprises a central portion and two mutually-opposite side arms extending from the central portion. Each side arm comprises a first portion attached to the central portion, the first portion being inwardly curved, and a second portion extending from the first portion and located above the central portion. The second portion of each side arm is substantially straight and defines an upwardly-oriented angle with reference to the central portion. The second portion also has a free end provided with an end face, the end face of both side arms defining a top-opened wire-receiving groove between them.

摘要翻译： 塌缩的桥式压接包括从中心部分延伸的中心部分和两个相互相对的侧臂。 每个侧臂包括附接到中心部分的第一部分，第一部分向内弯曲，以及从第一部分延伸并位于中心部分上方的第二部分。 每个侧臂的第二部分基本上是直的并且相对于中心部分限定向上定向的角度。 第二部分还具有设置有端面的自由端，两个侧臂的端面在它们之间限定顶部开放的线容纳槽。

公开(公告)号：US20060065537A1

公开(公告)日：2006-03-30

申请号：US11207172

申请日：2005-08-17

申请人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

发明人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

IPC分类号： C25D5/34 ,  C25D3/38

CPC分类号： C25D5/48 ,  C25D3/38 ,  H05K3/423

摘要： The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.