公开(公告)号：US20060183328A1

公开(公告)日：2006-08-17

申请号：US11203269

申请日：2005-08-12

申请人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

发明人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

IPC分类号： C25D3/38 ,  H01L21/44

CPC分类号： C25D3/38 ,  H01L21/2885 ,  H05K3/423

摘要： The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

公开(公告)号：US20060065537A1

公开(公告)日：2006-03-30

申请号：US11207172

申请日：2005-08-17

申请人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

发明人： Leon Barstad ,  James Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James Martin ,  Robert Schetty ,  Michael Toben

IPC分类号： C25D5/34 ,  C25D3/38

CPC分类号： C25D5/48 ,  C25D3/38 ,  H05K3/423

摘要： The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

公开(公告)号：US06444110B1

公开(公告)日：2002-09-03

申请号：US09313045

申请日：1999-05-17

申请人： Leon R. Barstad ,  James E. Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James L. Martin ,  Robert A. Schetty, III ,  Michael Toben

发明人： Leon R. Barstad ,  James E. Rychwalski ,  Mark Lefebvre ,  Stephane Menard ,  James L. Martin ,  Robert A. Schetty, III ,  Michael Toben

IPC分类号： C25D502

摘要： The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

公开(公告)号：US20060065538A1

公开(公告)日：2006-03-30

申请号：US11265382

申请日：2005-11-02

申请人： Robert Schetty ,  Michael Toben ,  James Martin ,  Neil Brown ,  Jeffrey Crosby ,  Keith Whitlaw

发明人： Robert Schetty ,  Michael Toben ,  James Martin ,  Neil Brown ,  Jeffrey Crosby ,  Keith Whitlaw

IPC分类号： C25D3/38 ,  C25D3/30

CPC分类号： C25D3/58 ,  C25D3/60 ,  H05K3/244

摘要： Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

公开(公告)号：US20050139644A1

公开(公告)日：2005-06-30

申请号：US11020406

申请日：2004-12-22

申请人： Nathaniel Brese ,  Michael Toben

发明人： Nathaniel Brese ,  Michael Toben

IPC分类号： H01L23/10 ,  B23K31/02 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  G02B6/42 ,  H01L21/52 ,  H01L23/12 ,  H01L23/28 ,  H01L23/48 ,  H05K1/18 ,  H05K3/34

CPC分类号： B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/3013 ,  B23K2103/52 ,  B23K2103/54 ,  G02B6/4202

摘要： Disclosed are methods of forming an electronic device. The methods involve (a) providing a substrate and a component to be bonded to the substrate, wherein the component is chosen from an electronic component, an optical component, a device lid, and a combination thereof; (b) applying solder paste to the substrate and/or the component, wherein the solder paste includes a carrier vehicle and a metal portion with metal particles; and (c) bringing the substrate and the component into contact with each other. The solder paste has a solidus temperature lower than the solidus temperature that would result after melting of the solder paste and re-solidification of the melt. Also provided are electronic devices which can be formed by the inventive methods. Particular applicability can be found in the electronics industry in the formation of hermetic electronic device packages, for example, hermetic optoelectronic device packages, formed from semiconductor wafers.

摘要翻译： 公开了形成电子设备的方法。 所述方法包括（a）提供衬底和要结合到衬底的部件，其中所述部件选自电子部件，光学部件，器件盖及其组合; （b）将焊膏施加到基板和/或部件上，其中焊膏包括载体载体和具有金属颗粒的金属部分; 和（c）使基板和部件彼此接触。 焊膏的固相线温度低于焊膏熔化后的固相线温度和熔体的再凝固。 还提供了可以通过本发明的方法形成的电子设备。 在电子工业中可以发现形成密封电子器件封装的特殊适用性，例如由半导体晶片形成的密封光电器件封装。

公开(公告)号：US20050199506A1

公开(公告)日：2005-09-15

申请号：US10913936

申请日：2004-08-06

申请人： Michael Toben ,  Neil Brown ,  Angelo Chirafisi

发明人： Michael Toben ,  Neil Brown ,  Angelo Chirafisi

IPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/60 ,  H05K1/03 ,  H05K3/24

CPC分类号： H05K3/244 ,  C25D3/32 ,  C25D3/60 ,  H05K1/0306

摘要： An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

摘要翻译： 用于在复合基板上选择性地沉积锡或锡合金膜的电解质。 还描述了在复合衬底上沉积锡或锡合金的方法。

公开(公告)号：US20050133572A1

公开(公告)日：2005-06-23

申请号：US11022235

申请日：2004-12-22

申请人： Nathaniel Brese ,  Michael Toben

发明人： Nathaniel Brese ,  Michael Toben

IPC分类号： H01L21/60 ,  B23K3/06 ,  B23K31/02 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K13/04

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0257 ,  H05K2203/043 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the contact pads. The solder paste includes a carrier vehicle and a metal component having metal particles. The solder paste has a solidus temperature lower than the solidus temperature that would result after melting of the solder paste and resolidification of the melt. Also provided are electronic components which can be formed by the inventive methods. Particular applicability can be found in the semiconductor industry in the formation of interconnect bumps on a semiconductor component, for example, for bonding an integrated circuit to a module circuit or printed wiring board using a bump bonding process.

摘要翻译： 公开了在电子部件上形成焊料区域的方法。 所述方法包括：（a）提供具有一个或多个接触垫的基底; 和（b）将焊膏涂覆在接触垫上。 焊膏包括载体载体和具有金属颗粒的金属组分。 焊膏的固相线温度低于焊膏熔化后的固相线温度和熔融物的再凝固。 还提供了可以通过本发明的方法形成的电子部件。 在半导体工业中，在形成半导体部件上的互连凸点的情况下，可以发现具体的适用性，例如，使用凸块接合工艺将集成电路与模块电路或印刷线路板接合。