公开(公告)号：US10340152B1

公开(公告)日：2019-07-02

申请号：US15857988

申请日：2017-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Hung-Yu Chou ,  Fu-Kang Lee ,  Steven Alfred Kummerl

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L23/49517 ,  H01L23/49548

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

公开(公告)号：US20190139868A1

公开(公告)日：2019-05-09

申请号：US15808537

申请日：2017-11-09

Applicant: Texas Instruments Incorporated

Inventor： Robert Allan Neidorff ,  Benjamin Cook ,  Steven Alfred Kummerl ,  Barry Jon Male ,  Peter Smeys

IPC: H01L23/495 ,  H01L23/485

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

公开(公告)号：US20190074270A1

公开(公告)日：2019-03-07

申请号：US15693985

申请日：2017-09-01

Applicant: Texas Instruments Incorporated

Inventor： Daniel Lee Revier ,  Steven Alfred Kummerl ,  Benjamin Stassen Cook

IPC: H01L25/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/367 ,  H01F7/02 ,  H01L21/687 ,  H01F7/20

Abstract: Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.