公开(公告)号：US20240039016A1

公开(公告)日：2024-02-01

申请号：US17877513

申请日：2022-07-29

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Tomoki Tambo ,  Ercan Dede ,  Yuqing Zhou

IPC: H01M8/04029 ,  H01M8/2485

CPC classification number: H01M8/04029 ,  H01M8/2485

Abstract: A fuel cell system includes: a first fuel cell; a second fuel cell; a cathode configured to receive a positive charge from the first fuel cell and the second fuel cell; an anode disposed apart from the cathode and configured to receive a negative charge from the first fuel cell and the second fuel cell; a manifold enclosing the anode and the cathode; coolant disposed within the manifold and surrounding the cathode and the anode; and a seal disposed between the cathode and the anode so as to prevent the coolant from leaking into the first fuel cell, wherein the cathode includes a seal portion disposed adjacent to the seal and a remaining portion separated from the seal by the seal portion, and wherein the remaining portion of the cathode is configured to be non-parallel with the anode so as to reduce shunt current at the seal portion.

公开(公告)号：US20230022829A1

公开(公告)日：2023-01-26

申请号：US17382521

申请日：2021-07-22

Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

Inventor： Feng Zhou ,  Hiroshi Ukegawa ,  Ercan Dede

IPC: H05K1/02 ,  H05K3/02

Abstract: Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

公开(公告)号：US11545297B2

公开(公告)日：2023-01-03

申请号：US16692653

申请日：2019-11-22

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. ,  University of Colorado Boulder

Inventor： Ercan Dede ,  Yucheng Gao ,  Vivek Sankaranarayanan ,  Aritra Ghosh ,  Robert Erickson ,  Dragan Maksimovic

IPC: H05K1/02 ,  H01F27/28 ,  H05K1/16 ,  H05K1/11 ,  H01F27/24

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

公开(公告)号：US11153556B1

公开(公告)日：2021-10-19

申请号：US16836036

申请日：2020-03-31

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Sean Rodrigues ,  Ercan Dede

IPC: H04N13/388 ,  G02B30/56 ,  B60K35/00 ,  H04N13/322

Abstract: Methods and systems may provide for 3D volumetric displays. Such 3D volumetric displays may include a transparent enclosed volume holding a gas as a stationary gain medium. A scanning mirror may direct a light beam from a light source. A voxel projector may receive the light beam from the scanning mirror and may project an expanded beam into a volume of the stationary gain medium. Changes in the X and Y orientation between the light beam from the scanning mirror and the voxel projector results in relatively larger changes in the X and Y dimension of the expanded beam that is projected into the volume of the stationary gain medium to produce a 3D image.

公开(公告)号：US20210306620A1

公开(公告)日：2021-09-30

申请号：US16836036

申请日：2020-03-31

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Sean Rodrigues ,  Ercan Dede

IPC: H04N13/388 ,  G02B30/56 ,  H04N13/322 ,  B60K35/00

Abstract: Methods and systems may provide for 3D volumetric displays. Such 3D volumetric displays may include a transparent enclosed volume holding a gas as a stationary gain medium. A scanning mirror may direct a light beam from a light source. A voxel projector may receive the light beam from the scanning mirror and may project an expanded beam into a volume of the stationary gain medium. Changes in the X and Y orientation between the light beam from the scanning mirror and the voxel projector results in relatively larger changes in the X and Y dimension of the expanded beam that is projected into the volume of the stationary gain medium to produce a 3D image.

公开(公告)号：US20180145009A1

公开(公告)日：2018-05-24

申请号：US15423636

申请日：2017-02-03

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Yuji Fukuoka ,  Ercan Dede ,  Kyosuke Miyagi

IPC: H01L23/473 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/3677 ,  H01L23/4735

Abstract: An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.