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公开(公告)号：US20210159007A1
公开(公告)日：2021-05-27
申请号：US16692370
申请日：2019-11-22
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Colorado Boulder
Inventor： Ercan M. DEDE , Tsuyoshi NOMURA , Robert ERICKSON , Dragan MAKSIMOVIC , Vivek SANKARANARAYANAN , Yucheng GAO , Aritra GHOSH
Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.
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公开(公告)号：US12002613B2
公开(公告)日：2024-06-04
申请号：US16692370
申请日：2019-11-22
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Colorado Boulder
Inventor： Ercan M. Dede , Tsuyoshi Nomura , Robert Erickson , Dragan Maksimovic , Vivek Sankaranarayanan , Yucheng Gao , Aritra Ghosh
CPC classification number: H01F27/22 , H01F27/18 , H01F27/266 , H05K7/20854 , H05K7/20881 , H05K7/209 , H05K7/20936 , H05K7/20336
Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.
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公开(公告)号：US11864357B2
公开(公告)日：2024-01-02
申请号：US17329727
申请日：2021-05-25
Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. , University of Colorado Boulder
Inventor： Feng Zhou , Yuqing Zhou , Ercan Mehmet Dede , Robert Erickson , Dragan Maksimovic , Vivek Sankaranarayanan , Yucheng Gao
IPC: H05K7/20
CPC classification number: H05K7/20509 , H05K7/209 , H05K7/20254
Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
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公开(公告)号：US20220248560A1
公开(公告)日：2022-08-04
申请号：US17162371
申请日：2021-01-29
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Colorado Boulder
Inventor： Feng Zhou , Ercan Mehmet Dede , Hiroshi Ukegawa , Robert Erickson , Dragan Maksimovic , Vivek Sankaranarayanan , Yucheng Gao
IPC: H05K7/20
Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.
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公开(公告)号：US20220386509A1
公开(公告)日：2022-12-01
申请号：US17329727
申请日：2021-05-25
Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. , University of Colorado Boulder
Inventor： Feng Zhou , Yuqing Zhou , Ercan Mehmet Dede , Robert Erickson , Dragan Maksimovic , Vivek Sankaranarayanan , Yucheng Gao
IPC: H05K7/20
Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
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Patent Agency Ranking
公开(公告)号：US20210242031A1
公开(公告)日：2021-08-05
申请号：US17164649
申请日：2021-02-01
Applicant: Tokyo Electron Limited , University of Colorado Boulder
Inventor： Omid Zandi , Paul Abel , Jacques Faguet , David Zywotko , Steven M. George
IPC: H01L21/311 , H01L21/02
Abstract: Method for selective etching of materials using an ultrathin etch stop layer (ESL), where the ESL is effective at a thickness as small as approximately one monolayer using atomic layer etching (ALE). A substrate processing method includes depositing a first film on a substrate, depositing a second film on the first film, and selectively etching the second film relative to the first film using an ALE process, where the etching self-terminates at an interface of the second film and the first film.
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公开(公告)号：US12215419B2
公开(公告)日：2025-02-04
申请号：US17733575
申请日：2022-04-29
Applicant: Eagle Technology, LLC , University of Colorado Boulder
Inventor： James Throckmorton , Tyler Myers , Rebecca Borrelli , Malcolm O'Sullivan , Tukaram Hatwar , Steven M. George
IPC: C23C16/455 , C23C16/02 , C23C16/34 , C23C16/40 , C23C28/04
Abstract: Methods of producing an optical surface atop an exterior of a substrate that includes smoothing the exterior using an ALD process to sequentially deposit ALD layers to produce one or more ALD films that fill spaces between spaced-apart asperities existing on the exterior, and thereafter depositing a reflective material on the smoothed exterior of the substrate to produce the optical surface. The smoothing resulting from depositing the ALD film on the exterior of the substrate causes the grain size of the reflective material to be reduced in comparison to the grain size that would exists without having deposited the ALD film on the exterior of the substrate. The smoothing is sufficient to cause a reduction in grain size that results in a reduction in plasmon absorption in the optical surface in comparison to the plasmon absorption that would otherwise exist without having reduced the grain size of the reflective material.
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公开(公告)号：US20230349042A1
公开(公告)日：2023-11-02
申请号：US17733575
申请日：2022-04-29
Applicant: Eagle Technology, LLC , University of Colorado Boulder
Inventor： James THROCKMORTON , Tyler MYERS , Rebecca BORRELLI , Malcolm O’SULLIVAN , Tukaram HATWAR , Steven M. GEORGE
IPC: C23C16/455 , C23C16/40 , C23C16/34 , C23C16/02 , C23C28/04
CPC classification number: C23C16/45525 , C23C16/402 , C23C16/403 , C23C16/405 , C23C16/407 , C23C16/345 , C23C16/0254 , C23C28/042
Abstract: Methods of producing an optical surface atop an exterior of a substrate that includes smoothing the exterior using an ALD process to sequentially deposit ALD layers to produce one or more ALD films that fill spaces between spaced-apart asperities existing on the exterior, and thereafter depositing a reflective material on the smoothed exterior of the substrate to produce the optical surface. The smoothing resulting from depositing the ALD film on the exterior of the substrate causes the grain size of the reflective material to be reduced in comparison to the grain size that would exists without having deposited the ALD film on the exterior of the substrate. The smoothing is sufficient to cause a reduction in grain size that results in a reduction in plasmon absorption in the optical surface in comparison to the plasmon absorption that would otherwise exist without having reduced the grain size of the reflective material.
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公开(公告)号：US11596088B2
公开(公告)日：2023-02-28
申请号：US17162371
申请日：2021-01-29
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Colorado Boulder
Inventor： Feng Zhou , Ercan Mehmet Dede , Hiroshi Ukegawa , Robert Erickson , Dragan Maksimovic , Vivek Sankaranarayanan , Yucheng Gao
IPC: H05K7/20
Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.
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公开(公告)号：US11545297B2
公开(公告)日：2023-01-03
申请号：US16692653
申请日：2019-11-22
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Colorado Boulder
Inventor： Ercan Dede , Yucheng Gao , Vivek Sankaranarayanan , Aritra Ghosh , Robert Erickson , Dragan Maksimovic
Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.
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