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1.发明公开公开(公告)号：US20230300972A1
公开(公告)日：2023-09-21
申请号：US17699389
申请日：2022-03-21
Inventor： Feng ZHOU , Ercan Dede , Hiroshi Ukegawa
CPC classification number: H05K1/0209 , H05K1/0272 , H05K3/4697 , H05K2201/10015
Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a printed circuit board (PCB) and an electrical insulation portion. The PCB includes a plurality of embedded power devices and a substrate layer having a plurality of metal inverse opal (MIO) portions. The electrically insulating portion is positioned between each of the MIO portions. The plurality of MIO portions is thermally coupled to the plurality of embedded power devices.
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公开(公告)号：US20230284377A1
公开(公告)日：2023-09-07
申请号：US17587255
申请日：2022-01-28
Inventor： Feng Zhou , Yanghe Liu , Hiroshi Ukegawa , Ercan Dede
CPC classification number: H05K1/0272 , H05K7/20509
Abstract: Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.
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公开(公告)号：US20190082560A1
公开(公告)日：2019-03-14
申请号：US15699549
申请日：2017-09-08
Inventor： Ercan Dede , Feng Zhou , Shailesh N. Joshi
Abstract: A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.
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公开(公告)号：US20240326825A1
公开(公告)日：2024-10-03
申请号：US18193972
申请日：2023-03-31
IPC: B60W40/08 , B60W60/00 , G06Q30/0251 , G06V20/59 , G06V40/16
CPC classification number: B60W40/08 , B60W60/00 , G06Q30/0265 , G06V20/597 , G06V40/16 , B60W2050/0075 , B60W2540/22 , B60W2540/221
Abstract: An autonomous vehicle feedback system includes at least one sensor embedded in an interior surface of a vehicle and a processor electrically coupled to the at least one sensor. The processor establishes a baseline for a physiological parameter of an occupant of the vehicle based on feedback from the at least one sensor, and provides an adjustment to at least one of a plurality of vehicle operations when a deviation of the physiological parameter compared to the baseline. The adjustment of the at least one of the plurality of vehicle operations is proportional to the deviation of the physiological parameter from the baseline.
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公开(公告)号：US20240119185A1
公开(公告)日：2024-04-11
申请号：US17938690
申请日：2022-10-07
Inventor： Sarah N. Hankins , Yuqing Zhou , Ercan Dede , Danny Lohan
IPC: G06F30/10
CPC classification number: G06F30/10 , G06F2113/08
Abstract: One or more multi-zoned microreactor flow field configurations that facilitate optimized reaction-fluid performance, and one or more methods of designing such multi-zoned microreactor flow fields.
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Patent Agency Ranking
公开(公告)号：US11582866B1
公开(公告)日：2023-02-14
申请号：US17382521
申请日：2021-07-22
Inventor： Feng Zhou , Hiroshi Ukegawa , Ercan Dede
Abstract: Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.
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7.发明授权公开(公告)号：US10192814B2
公开(公告)日：2019-01-29
申请号：US15423636
申请日：2017-02-03
Inventor： Yuji Fukuoka , Ercan Dede , Kyosuke Miyagi
IPC: H01L23/473 , H01L23/498 , H01L23/367
Abstract: An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.
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公开(公告)号：US20250088066A1
公开(公告)日：2025-03-13
申请号：US18466369
申请日：2023-09-13
Inventor： Shailesh Joshi , Danny Lohan , Ercan Dede
Abstract: Impingement cooling systems, electronic motor assemblies, and electric vertical take-off and landing (eVTOL) systems are disclosed. In one embodiment, an impingement cooling system includes an electronic device casing downstream a propulsion air-flow and one or more electronic devices housed in the electronic device casing. A plurality of fins extend from the electronic device casing. At least one of the plurality of fins is an airfoil fin. The airfoil fin includes a high-pressure side with an air inlet that receives the propulsion air-flow. An inner conduit is fluidly coupled to the air inlet and directs the propulsion air-flow over the electronic device casing. A low-pressure side with an air outlet is fluidly coupled to the inner conduit. The air outlet expels the propulsion air-flow into the atmosphere.
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公开(公告)号：US20250087386A1
公开(公告)日：2025-03-13
申请号：US18466303
申请日：2023-09-13
Inventor： Danny LOHAN , Shailesh Joshi , Ercan Dede
IPC: H01B7/42 , B60L53/18 , B60L53/302 , H01B7/02
Abstract: The present disclosure is directed to systems and methods for cooling an electric charging cable. The system includes a conductor core, a wick placed around an exterior of the conductor core, an outer cover surrounding the wick, wherein the outer cover comprises an inner surface, and wherein a space is formed between the wick and the inner surface of the outer cover, and one or more channels disposed within the space between the wick and the inner surface of the outer cover and coupled to the wick, wherein the one or more channels includes an outer surface and wherein the outer surface of the one or more channels is placed a distance from the inner surface of the outer cover.
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10.发明授权公开(公告)号：US11910521B2
公开(公告)日：2024-02-20
申请号：US17699389
申请日：2022-03-21
Inventor： Feng Zhou , Ercan Dede , Hiroshi Ukegawa
CPC classification number: H05K1/0209 , H05K1/0272 , H05K3/4697 , H05K2201/10015
Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a printed circuit board (PCB) and an electrical insulation portion. The PCB includes a plurality of embedded power devices and a substrate layer having a plurality of metal inverse opal (MIO) portions. The electrically insulating portion is positioned between each of the MIO portions. The plurality of MIO portions is thermally coupled to the plurality of embedded power devices.
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