公开(公告)号：US20220384358A1

公开(公告)日：2022-12-01

申请号：US17816030

申请日：2022-07-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Te-Chih Huang ,  Yu-Piao Fang

IPC: H01L23/544 ,  G03F7/20

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

公开(公告)号：US11448975B2

公开(公告)日：2022-09-20

申请号：US17171119

申请日：2021-02-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Te-Chih Huang ,  Yu-Piao Fang

IPC: G03F7/20 ,  G03F1/42 ,  G03F1/22 ,  G03F1/24

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

公开(公告)号：US10998213B2

公开(公告)日：2021-05-04

申请号：US16876875

申请日：2020-05-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: H01L21/673 ,  H01L21/677 ,  G03F7/20 ,  G03F1/22 ,  G03F1/66

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

公开(公告)号：US10777510B2

公开(公告)日：2020-09-15

申请号：US15396909

申请日：2017-01-03

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Jian-Hong Lin ,  Kuo-Yen Liu ,  Hsin-Chun Chang ,  Tzu-Li Lee ,  Yu-Ching Lee ,  Yih-Ching Wang

IPC: H01L23/00 ,  H01L23/58 ,  H01L27/02 ,  H01L23/522 ,  H01L21/768

Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.

公开(公告)号：US10031412B1

公开(公告)日：2018-07-24

申请号：US15491795

申请日：2017-04-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: G03F7/20 ,  G03F1/62 ,  G03F1/64 ,  G03F1/66

Abstract: A pellicle assembly is provided. The pellicle assembly includes a frame and a membrane connected to the frame. The pellicle assembly also includes housing connected to the frame. The pellicle assembly further includes capping member passing through an upper opening of the housing and movable along a longitudinal axis of the housing. In addition, the pellicle assembly includes fastening member connected to the capping member and movable along a direction that is perpendicular to the longitudinal axis. When the capping member is in a released position, the fastening member is located within the housing, and when the capping member is in a fastening position, a portion of the fastening member is moved to the outside of the housing for fixing a mask.