公开(公告)号：US07989348B2

公开(公告)日：2011-08-02

申请号：US11508140

申请日：2006-08-23

申请人： Kuniaki Yamaguchi ,  Tsuneo Torikoshi

发明人： Kuniaki Yamaguchi ,  Tsuneo Torikoshi

IPC分类号： H01L21/302

CPC分类号： B24B49/00 ,  B24B37/345

摘要： A polishing method that carries out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps thereby increasing the throughput. The polishing method for polishing workpieces by repeating the sequential operations of taking a workpiece out of a cassette in which a plurality of workpieces are stored, carrying out multi-step polishing of a surface of the workpiece and returning the workpiece to the cassette, includes carrying out one of the following two polishing processes for the workpiece taken out of the cassette: a first polishing process comprising carrying out the multi-step polishing under preset conditions and measurement of the surface of the workpiece before and after each polishing step; and a second polishing process comprising carrying out a predetermined step of the multi-step polishing under polishing conditions which have been modified based on the results of the measurement.

摘要翻译： 抛光方法，其在抛光步骤之间执行，同时省略了在抛光步骤之间进行的基底的表面状态的测量，从而进行改进的抛光条件（抛光配方）的多步抛光工艺，从而提高了生产量。 通过重复从存储多个工件的盒子中取出工件的顺序操作，对工件的表面进行多步抛光并将工件返回到盒子的抛光方法，包括承载 对于从盒中取出的工件进行以下两个抛光工艺之一：第一抛光工艺，包括在预设条件下进行多步抛光并在每个抛光步骤之前和之后测量工件的表面; 以及第二抛光工艺，包括在基于测量结果进行了修改的抛光条件下执行多步抛光的预定步骤。

公开(公告)号：US20090264052A1

公开(公告)日：2009-10-22

申请号：US11991064

申请日：2006-09-12

申请人： Tsuneo Torikoshi ,  Kuniaki Yamaguchi

发明人： Tsuneo Torikoshi ,  Kuniaki Yamaguchi

IPC分类号： B24B1/00 ,  B24B37/00 ,  B24B53/02

CPC分类号： B24B37/042 ,  B24B37/345 ,  B24B49/00

摘要： A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface; and starting polishing of a workpiece after completion of the preparatory process to polishing. Determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.

摘要翻译： 抛光方法可以在恢复抛光之前将抛光表面带到抛光的最佳状态，而不使用虚拟晶片等，从而消除虚拟晶片等的成本。 抛光方法包括：在抛光休息期间进行待机操作; 在完成待机操作之后，通过修整抛光表面同时向抛光表面提供抛光液体进行抛光的准备过程; 并且在完成准备处理之后开始对工件进行抛光。 关于在完成备用操作之后是否进行抛光的准备过程的确定可以基于待机操作的总操作时间或备用操作的总有效数量进行。

公开(公告)号：US20070049166A1

公开(公告)日：2007-03-01

申请号：US11508140

申请日：2006-08-23

申请人： Kuniaki Yamaguchi ,  Tsuneo Torikoshi

发明人： Kuniaki Yamaguchi ,  Tsuneo Torikoshi

IPC分类号： B24B51/00 ,  B24B49/00 ,  B24B29/00

CPC分类号： B24B49/00 ,  B24B37/345

摘要： A polishing method make it possible to carry out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps, as much as possible, thereby increasing the throughput. The polishing method for polishing workpieces by repeating the sequential operations of taking a workpiece out of a cassette in which a plurality of workpieces are stored, carrying out multi-step polishing of a surface of the workpiece and returning the workpiece to the cassette, includes carrying out one of the following two polishing processes for the workpiece taken out of the cassette: a first polishing process comprising carrying out the multi-step polishing under preset conditions and measurement of the surface of the workpiece before and after each polishing step; and a second polishing process comprising carrying out a predetermined step of the multi-step polishing under polishing conditions which have been modified based on the results of the measurement.

摘要翻译： 抛光方法可以尽可能地在抛光步骤之间执行抛光步骤（抛光配方）而进行多步抛光处理，同时省略对抛光步骤之间进行的表面条件的测量，从而提高生产量 。 通过重复从存储多个工件的盒子中取出工件的顺序操作，对工件的表面进行多步抛光并将工件返回到盒子的抛光方法，包括承载 对于从盒中取出的工件进行以下两个抛光工艺之一：第一抛光工艺，包括在预设条件下进行多步抛光并在每个抛光步骤之前和之后测量工件的表面; 以及第二抛光工艺，包括在基于测量结果进行了修改的抛光条件下执行多步抛光的预定步骤。