公开(公告)号：US06893719B1

公开(公告)日：2005-05-17

申请号：US09786100

申请日：2000-06-28

Applicant: Fuminori Nakajima ,  Nobuhisa Ishii ,  Masao Tachikura ,  Shigenori Uruno ,  Hisashi Izumita ,  Hitoshi Ishimaru ,  Kuniaki Yamaguchi

Inventor： Fuminori Nakajima ,  Nobuhisa Ishii ,  Masao Tachikura ,  Shigenori Uruno ,  Hisashi Izumita ,  Hitoshi Ishimaru ,  Kuniaki Yamaguchi

IPC: G02B6/44 ,  D02G3/00 ,  C08K5/15 ,  C08L5/53

CPC classification number: G02B6/4402 ,  G02B6/4436 ,  Y10T428/2913 ,  Y10T428/2933 ,  Y10T428/2967

Abstract: A single core optical fiber cord having an outer diameter of 1.2 mm or less, and having a structure in which an optical fiber core wire having a resin coating provided at the center, a tensile-strength-fiber layer around the periphery of the optical fiber core wire, and a coating layer around the outer periphery of the tensile-strength-fiber layer is provided. The coating layer can be composed of a non-halogen fire-retardant resin. The optical fiber cord has excellent fire retardant, mechanical and handling properties, although the outer diameter thereof is 1.2 mm or less.

Abstract translation: 具有1.2mm以下的外径的单芯光纤线，具有设置在中心的具有树脂覆膜的光纤芯线，在光纤周围的抗拉强度纤维层的结构 芯线，以及在拉伸强度纤维层的外周附近的涂层。 涂层可以由非卤素阻燃树脂构成。 虽然光纤线的外径为1.2mm以下，但光纤线具有优异的阻燃性，机械性和操作性。

公开(公告)号：US6116986A

公开(公告)日：2000-09-12

申请号：US969738

申请日：1997-11-13

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC: B24B37/04 ,  B24B57/00 ,  H01L21/00 ,  B24B1/00

CPC classification number: H01L21/67057 ,  B24B37/04 ,  B24B57/02

Abstract: A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.

Abstract translation: 抛光装置包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。 清洁装置具有清洁由抛光装置抛光的工件的清洁机。 连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置以从清洁装置排出废液的至少一个排放管被设置为分开的多个排水管道，依赖于 关于废液的类型。 通过使用本发明的抛光装置，可以有效地进行处理废液。

公开(公告)号：US6050884A

公开(公告)日：2000-04-18

申请号：US807810

申请日：1997-02-26

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC: B08B3/02 ,  B24B37/34 ,  B24B41/00 ,  H01L21/00 ,  B24B7/22

CPC classification number: B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

Abstract translation: 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转台上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

公开(公告)号：US6042455A

公开(公告)日：2000-03-28

申请号：US208987

申请日：1998-12-11

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Nobuyuki Takada

IPC: B24B37/34 ,  B24B53/007 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12 ,  H01L21/00 ,  B24B49/00

CPC classification number: H01L21/67219 ,  B24B37/345 ,  B24B53/017 ,  B24B55/06 ,  B24B55/12

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.

Abstract translation: 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有外壁和至少一个门的封闭结构，由封闭结构封闭的抛光部分，用于通过保持工件并将工件压靠在转台的抛光表面上来抛光工件的表面，传感器 用于检测门的打开或关闭;以及用于从封闭结构的内部排出环境空气的排气系统。 抛光装置还包括调节机构，用于调节从封闭结构内部排出的空气量。 当门关闭时，通过调节机构减少从封闭结构内部排出的空气量，并且当门打开时通过调节机构从封闭结构的内部排出的空气量增加。

公开(公告)号：US5961380A

公开(公告)日：1999-10-05

申请号：US12826

申请日：1998-01-23

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

IPC: B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B47/02

CPC classification number: H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

Abstract translation: 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 在工件保持部和机器人体之间设置用于机器人主体防水的盘构件，并且具有不小于工件保持部的面积。

公开(公告)号：US5944941A

公开(公告)日：1999-08-31

申请号：US947856

申请日：1997-10-09

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi

IPC: B08B17/00 ,  H01L21/00

CPC classification number: H01L21/67023 ,  B08B17/00

Abstract: The present invention provides a dry/wet work turning-over machine which can be used with both a dry hand and a wet hand and in which, even when the dry hand having a vacuum suction mechanism is inserted into a water-proof cover surrounding a work turning-over device, liquid is not adhered to the hand. In the dry/wet work turning-over machine, the work turning-over device is surrounded by the water-proof cover. An opening is formed in the water-proof cover at an upper surface of a front side thereof and a front part of an upper surface thereof. A screen for closing the opening is attached to the opening. The screen is rotated in a downward direction by a rotation driving mechanism.

Abstract translation: 本发明提供一种能够与干手和湿手一起使用的干湿式车间翻转机，即使将具有真空吸引机构的干手插入到围绕 工作翻转装置，液体不粘在手上。 在干/湿式翻转机中，工作翻转装置被防水罩包围。 在防水罩的前表面的上表面和其上表面的前部形成开口。 用于关闭开口的屏幕附接到开口。 屏幕通过旋转驱动机构沿向下的方向旋转。

公开(公告)号：US09067296B2

公开(公告)日：2015-06-30

申请号：US13454146

申请日：2012-04-24

Applicant: Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

Inventor： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

IPC: B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B57/02

CPC classification number: B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B57/02

Abstract: A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

Abstract translation: 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括事先确定抛光液的供给流量与抛光基板时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

公开(公告)号：US08592313B2

公开(公告)日：2013-11-26

申请号：US13167952

申请日：2011-06-24

Applicant: Kuniaki Yamaguchi ,  Tsuneo Torikoshi

Inventor： Kuniaki Yamaguchi ,  Tsuneo Torikoshi

IPC: H01L21/302 ,  H01L21/461

CPC classification number: B24B49/00 ,  B24B37/345

Abstract: A polishing method that carries out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps thereby increasing the throughput. The polishing method for polishing workpieces by repeating the sequential operations of taking a workpiece out of a cassette in which a plurality of workpieces are stored, carrying out multi-step polishing of a surface of the workpiece and returning the workpiece to the cassette, includes carrying out one of the following two polishing processes for the workpiece taken out of the cassette: a first polishing process comprising carrying out the multi-step polishing under preset conditions and measurement of the surface of the workpiece before and after each polishing step; and a second polishing process comprising carrying out a predetermined step of the multi-step polishing under polishing conditions which have been modified based on the results of the measurement.

Abstract translation: 抛光方法，其在抛光步骤之间执行，同时省略了在抛光步骤之间进行的基底的表面状态的测量，从而进行改进的抛光条件（抛光配方）的多步抛光工艺，从而提高了生产量。 通过重复从存储多个工件的盒子中取出工件的顺序操作，对工件的表面进行多步抛光并将工件返回到盒子的抛光方法，包括承载 对于从盒中取出的工件进行以下两个抛光工艺之一：第一抛光工艺，包括在预设条件下进行多步抛光并在每个抛光步骤之前和之后测量工件的表面; 以及第二抛光工艺，包括在基于测量结果进行了修改的抛光条件下执行多步抛光的预定步骤。

公开(公告)号：US08332064B2

公开(公告)日：2012-12-11

申请号：US11991064

申请日：2006-09-12

Applicant: Tsuneo Torikoshi ,  Kuniaki Yamaguchi

Inventor： Tsuneo Torikoshi ,  Kuniaki Yamaguchi

IPC: G06F19/00 ,  G05B13/02

CPC classification number: B24B37/042 ,  B24B37/345 ,  B24B49/00

Abstract: A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer, before resuming polishing, thereby eliminating the cost of dummy wafer. The polishing method includes carrying out a stand-by operation during a polishing-resting time period, carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface, and starting polishing of a workpiece after completion of the preparatory process to polishing. A determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.

Abstract translation: 抛光方法可以在恢复抛光之前将抛光表面带到抛光的最佳状态，而不使用虚设晶片，从而消除了伪晶片的成本。 抛光方法包括在抛光静止时间段内进行待机操作，在完成待机操作之后，通过修整抛光表面同时向抛光表面提供抛光液体进行抛光的准备过程 并且在完成准备处理之后开始抛光工件以进行抛光。 关于在完成备用操作后是否进行抛光的准备过程的决定可以基于待机操作的总操作时间或备用操作的总有效数量进行。

公开(公告)号：US06409582B1

公开(公告)日：2002-06-25

申请号：US09531589

申请日：2000-03-20

Applicant: Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

Inventor： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Shunichiro Kojima ,  Toyomi Nishi

IPC: B24B722

CPC classification number: B24B37/345 ,  B08B3/02 ,  B24B41/005 ,  H01L21/67051

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

Abstract translation: 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。 推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。 当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。