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21.发明申请公开(公告)号：US20070104870A1
公开(公告)日：2007-05-10
申请号：US11642754
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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22.发明申请公开(公告)号：US20070102684A1
公开(公告)日：2007-05-10
申请号：US11642698
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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23.发明申请公开(公告)号：US20070102678A1
公开(公告)日：2007-05-10
申请号：US11642669
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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24.发明申请公开(公告)号：US20070102677A1
公开(公告)日：2007-05-10
申请号：US11642668
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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25.发明申请公开(公告)号：US20070096064A1
公开(公告)日：2007-05-03
申请号：US11642688
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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26.发明申请公开(公告)号：US20070096062A1
公开(公告)日：2007-05-03
申请号：US11642662
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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27.发明申请公开(公告)号：US20080093423A1
公开(公告)日：2008-04-24
申请号：US11642752
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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28.发明申请公开(公告)号：US20070221887A1
公开(公告)日：2007-09-27
申请号：US11642689
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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29.发明申请公开(公告)号：US20070104878A1
公开(公告)日：2007-05-10
申请号：US11642706
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K1/167 , B33Y10/00 , B33Y80/00 , C09D11/30 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/125 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
摘要翻译： 用于制造诸如电阻器和电容器的电子特征的前体组合物。 将前体组合物配制成具有低转化温度，例如不大于约350℃，从而使得能够在各种基材上制造这样的电子特征，包括有机基底如聚合物基底。
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公开(公告)号：US20070104877A1
公开(公告)日：2007-05-10
申请号：US11642705
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K1/167 , B33Y10/00 , B33Y80/00 , C09D11/30 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/125 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
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