公开(公告)号：US20070207565A1

公开(公告)日：2007-09-06

申请号：US11746475

申请日：2007-05-09

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01L21/02

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： Processes for forming photovoltaic features and in particular photovoltaic conductive features. In one aspect, the process comprises printing a primer material onto a substrate; etching the substrate with the primer material to form an etched substrate; printing a precursor composition onto the etched substrate, wherein the precursor composition comprises at least one of metallic nanoparticles comprising a metal or a metal precursor compound to the metal; and heating the precursor composition to form the photovoltaic feature on the substrate.

摘要翻译： 用于形成光伏特征，特别是光伏导电特征的方法。 一方面，该方法包括将底漆材料印刷在基材上; 用底漆蚀刻衬底以形成蚀刻的衬底; 将前体组合物印刷到蚀刻的基底上，其中前体组合物包含至少一种包含金属或金属前体化合物的金属纳米颗粒; 并加热前体组合物以在基底上形成光电特征。

公开(公告)号：US20070120099A1

公开(公告)日：2007-05-31

申请号：US11642723

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070104883A1

公开(公告)日：2007-05-10

申请号：US11642753

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070104880A1

公开(公告)日：2007-05-10

申请号：US11642711

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070102683A1

公开(公告)日：2007-05-10

申请号：US11642697

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070102682A1

公开(公告)日：2007-05-10

申请号：US11642695

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070096065A1

公开(公告)日：2007-05-03

申请号：US11642696

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20080093423A1

公开(公告)日：2008-04-24

申请号：US11642752

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B23K31/02 ,  B23K35/24 ,  H01L21/00

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070221887A1

公开(公告)日：2007-09-27

申请号：US11642689

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070104878A1

公开(公告)日：2007-05-10

申请号：US11642706

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K1/167 ,  B33Y10/00 ,  B33Y80/00 ,  C09D11/30 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.

摘要翻译： 用于制造诸如电阻器和电容器的电子特征的前体组合物。 将前体组合物配制成具有低转化温度，例如不大于约350℃，从而使得能够在各种基材上制造这样的电子特征，包括有机基底如聚合物基底。