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公开(公告)号：US20070207565A1
公开(公告)日：2007-09-06
申请号：US11746475
申请日：2007-05-09
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01L21/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： Processes for forming photovoltaic features and in particular photovoltaic conductive features. In one aspect, the process comprises printing a primer material onto a substrate; etching the substrate with the primer material to form an etched substrate; printing a precursor composition onto the etched substrate, wherein the precursor composition comprises at least one of metallic nanoparticles comprising a metal or a metal precursor compound to the metal; and heating the precursor composition to form the photovoltaic feature on the substrate.
摘要翻译： 用于形成光伏特征，特别是光伏导电特征的方法。 一方面，该方法包括将底漆材料印刷在基材上; 用底漆蚀刻衬底以形成蚀刻的衬底; 将前体组合物印刷到蚀刻的基底上，其中前体组合物包含至少一种包含金属或金属前体化合物的金属纳米颗粒; 并加热前体组合物以在基底上形成光电特征。
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2.发明申请公开(公告)号：US20070120099A1
公开(公告)日：2007-05-31
申请号：US11642723
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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3.发明申请公开(公告)号：US20070104883A1
公开(公告)日：2007-05-10
申请号：US11642753
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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4.发明申请公开(公告)号：US20070104880A1
公开(公告)日：2007-05-10
申请号：US11642711
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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5.发明申请公开(公告)号：US20070102683A1
公开(公告)日：2007-05-10
申请号：US11642697
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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6.发明申请公开(公告)号：US20070102682A1
公开(公告)日：2007-05-10
申请号：US11642695
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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7.发明申请公开(公告)号：US20070096065A1
公开(公告)日：2007-05-03
申请号：US11642696
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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公开(公告)号：US20070178232A1
公开(公告)日：2007-08-02
申请号：US11642751
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
摘要： Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
摘要翻译： 胶带形式的前体组合物可以转移到基底并在相对低的温度例如不大于约200℃下转化成电子特征。胶带组合物可以设置在载体上以形成带状物 结构灵活，可以在各种工业过程中处理。
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9.发明申请Methods and compositions for the formation of recessed electrical features on a substrate 审中-公开用于在基底上形成凹陷电特征的方法和组合物公开(公告)号：US20070122932A1
公开(公告)日：2007-05-31
申请号：US11642665
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01L21/00
CPC分类号： C09D11/30 , C23C18/08 , H01B1/026 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/02205 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/4061 , H05K3/4069 , H05K2201/09036 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
摘要： Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.
摘要翻译： 具有低转化温度的前体组合物和用于从前体组合物制造凹陷电特征的方法。 电气特征可以是导体，电阻和电介质特征。 将前体组合物沉积到形成在基底中的凹陷特征，例如沟槽，并在低温下反应以形成具有良好电学和机械性能的电特征。 衬底可以是低温衬底，例如有机衬底。
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10.发明申请公开(公告)号：US20070104881A1
公开(公告)日：2007-05-10
申请号：US11642720
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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