公开(公告)号：US20070194403A1

公开(公告)日：2007-08-23

申请号：US11360345

申请日：2006-02-23

申请人： Ethan Cannon ,  Toshiharu Furukawa ,  Mark Hakey ,  David Horak ,  Charles Koburger ,  Jimmy Kontos ,  Jack Mandelman ,  William Tonti

发明人： Ethan Cannon ,  Toshiharu Furukawa ,  Mark Hakey ,  David Horak ,  Charles Koburger ,  Jimmy Kontos ,  Jack Mandelman ,  William Tonti

IPC分类号： H01L21/76

CPC分类号： H01L27/0921 ,  H01L21/76229 ,  H01L21/823878

摘要： Semiconductor methods and device structures for suppressing latch-up in bulk CMOS devices. The method comprises forming a trench in the semiconductor material of the substrate with first sidewalls disposed between a pair of doped wells, also defined in the semiconductor material of the substrate. The method further comprises forming an etch mask in the trench to partially mask the base of the trench, followed by removing the semiconductor material of the substrate exposed across the partially masked base to define narrowed second sidewalls that deepen the trench. The deepened trench is filled with a dielectric material to define a trench isolation region for devices built in the doped wells. The dielectric material filling the deepened extension of the trench enhances latch-up suppression.

摘要翻译： 用于抑制大量CMOS器件中的闩锁的半导体方法和器件结构。 该方法包括在衬底的半导体材料中形成沟槽，其第一侧壁设置在也在衬底的半导体材料中定义的一对掺杂阱之间。 该方法还包括在沟槽中形成蚀刻掩模以部分地掩蔽沟槽的基底，随后去除暴露在部分屏蔽的基底上的衬底的半导体材料，以限定加深沟槽的变窄的第二侧壁。 加深的沟槽填充有介电材料以限定用于内置于掺杂阱中的器件的沟槽隔离区域。 填充沟槽加深的介质材料增强了闩锁抑制。

公开(公告)号：US20070190713A1

公开(公告)日：2007-08-16

申请号：US11307671

申请日：2006-02-16

申请人： Bruce Doris ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Bruce Doris ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L21/8238

CPC分类号： H01L21/32139 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/823828 ,  H01L21/823864

摘要： A sidewall image transfer process for forming sub-lithographic structures employs a layer of sacrificial polymer containing silicon that is deposited over a gate conductor layer and covered by a cover layer. The sacrificial polymer layer is patterned with conventional resist and etched to form a sacrificial mandrel. The edges of the mandrel are oxidized or nitrided in a plasma at low temperature, after which the polymer and the cover layer are stripped, leaving sublithographic sidewalls. The sidewalls are used as hardmasks to etch sublithographic gate structures in the gate conductor layer.

摘要翻译： 用于形成亚光刻结构的侧壁图像转印工艺使用沉积在栅极导体层上并被覆盖层覆盖的含有硅的牺牲聚合物层。 牺牲聚合物层用常规抗蚀剂图案化并蚀刻以形成牺牲心轴。 心轴的边缘在低温下在等离子体中被氧化或氮化，之后剥离聚合物和覆盖层，留下亚光刻的侧壁。 侧壁用作硬掩模来蚀刻栅极导体层中的亚光刻栅极结构。

公开(公告)号：US20070166981A1

公开(公告)日：2007-07-19

申请号：US11335372

申请日：2006-01-19

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Chung Lam

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Chung Lam

IPC分类号： H01L21/44

CPC分类号： H01L21/76816 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31144 ,  H01L21/76885

摘要： Methods for fabricating a semiconductor device include forming a first layer on an underlying layer, forming a hardmask on the first layer, and patterning holes through the hardmask and first layer. An overhang is formed extending over sides of the holes. A conformal layer is deposited over the overhang and in the holes until the conformal layer closes off the holes to form a void/seam in each hole. The void/seam in each hole is exposed by etching back a top surface. The void/seam in each hole is extended to the underlying layer.

摘要翻译： 制造半导体器件的方法包括在下层上形成第一层，在第一层上形成硬掩模，以及通过硬掩模和第一层图形化孔。 形成在孔的侧面上延伸的突出端。 保形层沉积在悬垂孔和孔中，直到共形层封闭孔，以在每个孔中形成空隙/接缝。 每个孔中的空隙/接缝通过蚀刻顶部表面而暴露出来。 每个孔中的空隙/接缝延伸到下层。

公开(公告)号：US20070125946A1

公开(公告)日：2007-06-07

申请号：US11164792

申请日：2005-12-06

申请人： Carol Boye ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Carol Boye ,  Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： G21K7/00

CPC分类号： G01Q60/42 ,  G01Q70/12

摘要： A Y-shaped carbon nanotube atomic force microscope probe tip and methods comprise a shaft portion; a pair of angled arms extending from a same end of the shaft portion, wherein the shaft portion and the pair of angled arms comprise a chemically modified carbon nanotube, and wherein the chemically modified carbon nanotube is modified with any of an amine, carboxyl, fluorine, and metallic component. Preferably, each of the pair of angled arms comprises a length of at least 200 nm and a diameter between 10 and 200 nm. Moreover, the chemically modified carbon nanotube is preferably adapted to allow differentiation between substrate materials to be probed. Additionally, the chemically modified carbon nanotube is preferably adapted to allow fluorine gas to flow through the chemically modified carbon nanotube onto a substrate to be characterized. Furthermore, the chemically modified carbon nanotube is preferably adapted to chemically react with a substrate surface to be characterized.

摘要翻译： Y型碳纳米管原子力显微镜探针头和方法包括轴部分; 一对成角度的臂，其从所述轴部的同一端延伸，其中所述轴部和所述一对成角度的臂包括化学改性的碳纳米管，并且其中所述化学改性的碳纳米管用胺，羧基，氟 ，和金属成分。 优选地，一对成角度的臂中的每一个包括至少200nm的长度和10和200nm之间的直径。 此外，化学改性的碳纳米管优选适于允许待探测的基底材料之间的分化。 此外，化学改性的碳纳米管优选适于使氟气通过化学改性的碳纳米管流动到待表征的基底上。 此外，化学改性的碳纳米管优选适于与要表征的基材表面发生化学反应。

公开(公告)号：US20070108473A1

公开(公告)日：2007-05-17

申请号：US11164217

申请日：2005-11-15

申请人： Toshiharu Furukawa ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L29/76 ,  H01L29/745

CPC分类号： H01L31/101 ,  H01L27/14647 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： An optical sensor and method for forming the same. The optical sensor structure includes (a) a semiconductor substrate, (b) first, second, third, fourth, fifth, and sixth electrodes and (c) first, second, and third semiconducting regions. The first and fourth electrodes are at a first depth. The second and fifth electrodes are at a second depth. The third and sixth electrodes are at a third depth. The first depth is greater than the second depth, and the second depth is greater than the third depth. The first, second, and third semiconducting regions are disposed between and in contact with the first and fourth electrodes, second and fifth electrodes, and third and sixth electrodes, respectively. The first, second, and third semiconducting regions are in contact with each other.

摘要翻译： 一种光学传感器及其形成方法。 光学传感器结构包括（a）半导体衬底，（b）第一，第二，第三，第四，第五和第六电极以及（c）第一，第二和第三半导电区域。 第一和第四电极处于第一深度。 第二和第五电极处于第二深度。 第三和第六电极处于第三深度。 第一深度大于第二深度，第二深度大于第三深度。 第一，第二和第三半导体区域分别设置在第一和第四电极，第二和第五电极以及第三和第六电极之间并与之接触。 第一，第二和第三半导电区域彼此接触。

公开(公告)号：US20070023839A1

公开(公告)日：2007-02-01

申请号：US11161219

申请日：2005-07-27

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger

IPC分类号： H01L27/12

CPC分类号： H01L29/785 ,  B82Y10/00 ,  H01L29/4908 ,  H01L29/66795 ,  H01L51/0048 ,  H01L51/0512

摘要： A fin field effect transistor (FinFET) gate comprises a semiconductor wafer; a gate dielectric layer over the semiconductor wafer; a conductive material on the gate dielectric layer; an activated carbon nanotube on a surface of the conductive material; and a plated metal layer on the activated carbon nanotube. Preferably, the carbon nanotube is on a sidewall of the conductive material. The conductive material comprises a first metal layer over the gate dielectric layer, wherein the first metal layer acts as a catalyst for growing the carbon nanotube, wherein the first metal layer is preferably in a range of 1-10 nm in thickness. The semiconductor wafer may comprise a silicon on insulator wafer. The FinFET gate may further comprise a second metal layer disposed between the first metal layer and the gate dielectric layer.

摘要翻译： 鳍状场效应晶体管（FinFET）栅极包括半导体晶片; 半导体晶片上的栅介质层; 栅介电层上的导电材料; 导电材料表面上的活性炭纳米管; 和活化碳纳米管上的电镀金属层。 优选地，碳纳米管位于导电材料的侧壁上。 导电材料包括在栅极介电层上的第一金属层，其中第一金属层用作生长碳纳米管的催化剂，其中第一金属层的厚度优选在1-10nm的范围内。 半导体晶片可以包括绝缘体上硅晶片。 FinFET栅极还可以包括设置在第一金属层和栅极介电层之间的第二金属层。

公开(公告)号：US20060186416A1

公开(公告)日：2006-08-24

申请号：US10906557

申请日：2005-02-24

申请人： Toshiharu Furukawa ,  David Horak ,  Charles Koburger ,  Leathen Shi

发明人： Toshiharu Furukawa ,  David Horak ,  Charles Koburger ,  Leathen Shi

IPC分类号： H01L29/15 ,  H01L31/0312

CPC分类号： H01L29/045 ,  H01L21/76254 ,  H01L21/823807 ,  H01L27/1203

摘要： A semiconductor on insulator substrate and a method of fabricating the substrate. The substrate including: a first crystalline semiconductor layer and a second crystalline semiconductor layer; and an insulating layer bonding a bottom surface of the first crystalline semiconductor layer to a top surface of the second crystalline semiconductor layer, a first crystal direction of the first crystalline semiconductor layer aligned relative to a second crystal direction of the second crystalline semiconductor layer, the first crystal direction different from the second crystal direction.

摘要翻译： 绝缘体上半导体衬底及其制造方法。 所述基板包括：第一晶体半导体层和第二晶体半导体层; 以及将所述第一晶体半导体层的底面与所述第二结晶半导体层的顶面接合的绝缘层，所述第一结晶半导体层相对于所述第二结晶半导体层的第二晶体方向排列的第一晶体方向， 第一晶体方向与第二晶体方向不同。

公开(公告)号：US20060157743A1

公开(公告)日：2006-07-20

申请号：US11375624

申请日：2006-03-14

申请人： Toshiharu Furukawa ,  David Horak ,  Charles Koburger

发明人： Toshiharu Furukawa ,  David Horak ,  Charles Koburger

IPC分类号： H01L29/76 ,  H01L29/745

CPC分类号： H01L21/28518 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/11 ,  H01L27/1104

摘要： A borderless contact structure and method of fabricating the structure, the method including: (a) providing a substrate; (b) forming a polysilicon line on the substrate, the polysilicon line having sidewalls; (c) forming an insulating sidewall layer on the sidewalls of the polysilicon line; (d) removing a portion of the polysilicon line and a corresponding portion of the insulating sidewall layer in a contact region of the polysilicon line; and (e) forming a silicide layer on the sidewall of the polysilicon line in the contact region. Also an SRAM cell using the borderless contact structure and a method of fabricating the SRAM cell.

摘要翻译： 一种无边界接触结构和制造该结构的方法，所述方法包括：（a）提供基底; （b）在所述衬底上形成多晶硅线，所述多晶硅线具有侧壁; （c）在多晶硅线路的侧壁上形成绝缘侧壁层; （d）在所述多晶硅线的接触区域中去除所述多晶硅线的一部分和所述绝缘侧壁层的相应部分; 和（e）在接触区域中的多晶硅线路的侧壁上形成硅化物层。 也是使用无边界接触结构的SRAM单元和制造SRAM单元的方法。

公开(公告)号：US20060008927A1

公开(公告)日：2006-01-12

申请号：US11221118

申请日：2005-09-07

申请人： Toshiharu Furukawa ,  Mark Hakey ,  David Horak ,  Charles Koburger ,  Mark Masters ,  Peter Mitchell

发明人： Toshiharu Furukawa ,  Mark Hakey ,  David Horak ,  Charles Koburger ,  Mark Masters ,  Peter Mitchell

IPC分类号： H01L21/00

CPC分类号： H01L27/108 ,  H01L27/10826 ,  H01L27/10879 ,  H01L29/66795 ,  H01L29/785

摘要： A memory gain cell for a memory circuit, a memory circuit formed from multiple memory gain cells, and methods of fabricating such memory gain cells and memory circuits. The memory gain cell includes a storage device capable of holding a stored electrical charge, a write device, and a read device. The read device includes a fin of semiconducting material, electrically-isolated first and second gate electrodes flanking the fin, and a source and drain formed in the fin adjacent to the first and the second gate electrodes. The first gate electrode is electrically coupled with the storage device. The first and second gate electrodes are operative for gating a region of the fin defined between the source and the drain to thereby regulate a current flowing from the source to the drain. When gated, the magnitude of the current is dependent upon the electrical charge stored by the storage device.

摘要翻译： 用于存储器电路的存储增益单元，由多个存储器增益单元形成的存储器电路，以及制造这种存储器增益单元和存储器电路的方法。 存储器增益单元包括能够保存存储的电荷的存储装置，写入装置和读取装置。 读取装置包括半导体材料的翅片，鳍片侧面的电隔离的第一和第二栅电极，以及形成在与第一和第二栅电极相邻的鳍片中的源极和漏极。 第一栅电极与存储装置电耦合。 第一和第二栅极电极用于选通限定在源极和漏极之间的鳍片的区域，从而调节从源极流到漏极的电流。 当门控时，电流的大小取决于存储设备存储的电量。

公开(公告)号：US20050202322A1

公开(公告)日：2005-09-15

申请号：US10798908

申请日：2004-03-11

申请人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

发明人： Toshiharu Furukawa ,  Mark Hakey ,  Steven Holmes ,  David Horak ,  Charles Koburger ,  Peter Mitchell ,  Larry Nesbit

IPC分类号： G03C5/00 ,  G03F1/00 ,  G03F9/00

CPC分类号： G03F1/30

摘要： Methods for fabricating alternating phase shift masks or reticles used in semiconductor optical lithography systems. The methods generally include forming a layer of phase shift mask material on a handle substrate and patterning the layer to define recessed phase shift windows. The patterned layer is transferred from the handle wafer to a mask blank. The depth of the phase shift windows is determined by the thickness of the layer of phase shift mask material and is independent of the patterning process. In particular, the depth of the phase shift windows is not dependent upon the etch rate uniformity of an etch process across a surface of a mask blank.

摘要翻译： 用于制造用于半导体光刻系统中的交替相移掩模或掩模版的方法。 所述方法通常包括在手柄基板上形成一层相移掩模材料，并且图案化该层以限定凹陷的相移窗口。 图案层从手柄晶片转移到掩模板。 相移窗口的深度由相移掩模材料层的厚度确定，并且与图案化工艺无关。 特别地，相移窗口的深度不依赖于通过掩模板的表面的蚀刻工艺的蚀刻速率均匀性。