MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    21.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    多层电子元件及其制造方法

    公开(公告)号:US20080210564A1

    公开(公告)日:2008-09-04

    申请号:US12110484

    申请日:2008-04-28

    IPC分类号: C25D5/02 H01G4/008

    摘要: A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

    摘要翻译: 一种多层电子部件的制造方法,其特征在于,包括以下步骤:层叠多个绝缘层的层叠体,以及沿着所述绝缘层的界面形成的多个内部电极,以预定的方式露出所述内部电极的边缘 表面,并且在预定表面上形成外部电极,以便电连接在层压体的预定表面处暴露的内部电极的边缘。 形成外部电极的步骤包括:电镀步骤,通过在制备层压体的步骤中制备的层压体的预定表面处暴露在内部电极的边缘上沉积电镀沉积物形成连续的镀膜,并进行电镀 电镀沉积物的生长以彼此连接;以及热处理步骤,对形成在其上的镀膜的层压体在氧分压为约5ppm以下,温度为 约600℃以上。