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公开(公告)号：US09165714B2
公开(公告)日：2015-10-20
申请号：US13479397
申请日：2012-05-24
申请人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
发明人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.
摘要翻译： 抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。 端子电极的外部电极位于电子元件的第一和第二端面上。 包含电镀Ni的第一电镀膜位于外部电极的表面上。 第二镀膜位于第一镀膜的表面上。 第二镀膜具有包括第一镀层和第二镀层的堆叠结构。 第二镀层比第一镀层具有较低的致密化程度。
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2.发明申请NETWORK VIRTUALIZATION SYSTEM, PHYSICAL NODE, AND VIRTUAL INTERFACE IDENTIFICATION METHOD IN VIRTUAL MACHINE 有权虚拟机网络虚拟化系统，物理节点和虚拟界面识别方法公开(公告)号：US20140123140A1
公开(公告)日：2014-05-01
申请号：US13993065
申请日：2011-10-04
申请人： Akihiro Motoki
发明人： Akihiro Motoki
IPC分类号： G06F9/455
CPC分类号： G06F9/45533 , H04L41/0806
摘要： A domain management apparatus instructs physical nodes about the configuration of virtual nodes and virtual links of virtual networks. The physical nodes assign a virtual machine to a virtual node based on the definition of the virtual node contained in an instruction from the domain management apparatus. The physical nodes write a configuration associating virtual interfaces in the virtual node definition with virtual NICs on the virtual machine into a configuration file of the operating system to be started up on the virtual machine before the start-up of the virtual machine and, then, start up the virtual machine. Therefore, it is possible to recognize the correspondence relation between the virtual interface in the virtual node definition and the virtual NIC in the virtual machine without referring to the virtual network assignment result and without waiting for the start-up of the virtual machine.
摘要翻译： 域管理装置向物理节点指示虚拟网络的虚拟节点和虚拟链路的配置。 物理节点基于来自域管理装置的指令中包含的虚拟节点的定义，将虚拟机分配给虚拟节点。 物理节点写入将虚拟节点定义中的虚拟接口与虚拟机上的虚拟NIC相关联的配置，以在虚拟机启动之前在虚拟机上启动的操作系统的配置文件中， 启动虚拟机。 因此，可以在不参照虚拟网络分配结果的情况下，识别虚拟节点定义中的虚拟接口与虚拟机中的虚拟NIC之间的对应关系，而不用等待虚拟机的启动。
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公开(公告)号：US08665053B2
公开(公告)日：2014-03-04
申请号：US13411863
申请日：2012-03-05
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Wataru Ogawa
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Wataru Ogawa
IPC分类号： H01F5/00
CPC分类号： H01G4/30 , H01C7/13 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G4/12 , H01G4/2325
摘要： A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.
摘要翻译： 层叠陶瓷电子部件的制造方法能够形成作为连接内部电极的露出端的外部电极的至少一部分的电镀膜。 制备包括多个陶瓷层和从部件主体部分露出的多个内部电极的部件主体，使得部件主体具有由末端包括在内部电极中的导电部件的扩散形成的导电区域 位于多个内部电极的相邻的露出端之间的陶瓷层的表面。 陶瓷层优选由含有约10重量％以上的玻璃成分的玻璃陶瓷构成。 通过使内部电极和导电区域的露出端生长成电镀沉积的核，直接在部件主体上形成镀膜。
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公开(公告)号：US08508913B2
公开(公告)日：2013-08-13
申请号：US13337445
申请日：2011-12-27
申请人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
发明人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
IPC分类号： H01G4/228
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译： 在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理 电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。 为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。 因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。
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5.发明授权公开(公告)号：US08503160B2
公开(公告)日：2013-08-06
申请号：US13208416
申请日：2011-08-12
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译： 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。
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公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译： 陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。 外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。 镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。
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公开(公告)号：US20120236461A1
公开(公告)日：2012-09-20
申请号：US13419545
申请日：2012-03-14
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译： 陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。 第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。 类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。 在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。
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公开(公告)号：US08254081B2
公开(公告)日：2012-08-28
申请号：US12617879
申请日：2009-11-13
IPC分类号： H01G4/00
CPC分类号： H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.
摘要翻译： 在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度 和组件主体。 将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。 此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散 。
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公开(公告)号：US20120169180A1
公开(公告)日：2012-07-05
申请号：US13337445
申请日：2011-12-27
申请人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
发明人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译： 在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理 电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。 为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。 因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。
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公开(公告)号：US08194391B2
公开(公告)日：2012-06-05
申请号：US12340570
申请日：2008-12-19
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。
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