摘要:
A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.
摘要:
While a rectangular sheet is being passed between a masking packing having at least one opening of a configuration corresponding to the selected area of the sheet to be plated and a pressure packing, a jet of plating solution is continuously directed from a nozzle against the masking packing opening or a jet of plating solution is intermittently directed from a specially designed nozzle against the opening in response to the intermittent movement of the rectangular sheet, thereby selectively plating the rectangular sheet in the lengthwise direction continuously or intermittently.