公开(公告)号：US20070223198A1

公开(公告)日：2007-09-27

申请号：US11309226

申请日：2006-07-13

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

摘要翻译： 存储模块组件包括一对散热板（10），夹在散热板（10）之间的印刷电路板（20）和用于固定散热板（10）的四个夹具（30） 在印刷电路板（20）的相对侧上。 每个夹具包括连接部分（32）和从连接部分的相对的自由端延伸的一对弹性按压部分（34）。 每个按压部分具有从其相对侧面延伸的一对钩（342）和从其自由端延伸（344）并且夹持在散热板的端部上的接合部。 将钩插入到限定在散热板中的开口（18）中，并与散热板的内表面接合。

公开(公告)号：US08377214B2

公开(公告)日：2013-02-19

申请号：US12534880

申请日：2009-08-04

申请人： Sheng-Chao Zhang ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Sheng-Chao Zhang ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： C23C16/00

CPC分类号： F28D15/0233 ,  F28D15/046 ,  F28F2225/04 ,  F28F2240/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49888 ,  H01L2924/00

摘要： A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.

摘要翻译： 蒸气室包括容纳工作液体的密封扁平壳体，布置在壳体内表面上的芯结构，容纳在壳体中的支撑板和多个支撑柱。 支撑板在其中限定多个固定孔。 支撑柱被卡合在支撑板的固定孔中。 支撑柱的顶端和底端与油绳结构接合以加强蒸气室的结构。

公开(公告)号：US07942557B2

公开(公告)日：2011-05-17

申请号：US12238422

申请日：2008-09-25

申请人： Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F21V29/00

CPC分类号： F21V29/67 ,  F21V29/763 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.

摘要翻译： LED灯包括散热器，离心鼓风机和多个LED模块。 散热器包括限定与基板的端部相邻的进气口的底板和从基板的底表面向下延伸的多个翅片，位于进气口和基板的相对的远端之间。 离心鼓风机安装在基板的底面上，位于进气口和散热片之间。 LED模块固定在散热器底板的顶面上。 壳体与基板接合以将离心鼓风机和翅片封闭在其中并与底板协作以在基板的相对的远端和壳体的相应侧壁之间限定排气口。

公开(公告)号：US07457122B2

公开(公告)日：2008-11-25

申请号：US11309225

申请日：2006-07-13

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： G11C5/143 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

摘要翻译： 存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。 第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244） 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部（34）。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

公开(公告)号：US07438449B2

公开(公告)日：2008-10-21

申请号：US11621759

申请日：2007-01-10

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B60Q1/06

CPC分类号： F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

摘要翻译： LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。

公开(公告)号：US07391613B2

公开(公告)日：2008-06-24

申请号：US11308839

申请日：2006-05-12

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

摘要翻译： 存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极（24）。 第二散热器包括设置在其中并与其热连接的热管（36）。 夹具包括连接部分（42）和一对弹性按压部分（44）。 夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。

公开(公告)号：US20080098898A1

公开(公告)日：2008-05-01

申请号：US11309918

申请日：2006-10-27

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B01D19/00

CPC分类号： B01D19/0057 ,  B01D19/0031 ,  B04C3/00 ,  B04C2003/006

摘要： A gas-liquid separation apparatus includes a crust and a separating pipe located in the crust. The crust includes an annular wall and two lids covering two ends of the wall. The crust has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the crust and in communication with the inlet and the outlet of the crust. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the crust. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the crust. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the crust.

摘要翻译： 气液分离装置包括位于地壳中的外壳和分离管。 地壳包括一个环形壁，两个盖子覆盖墙壁的两端。 地壳有一个由墙壁和两个盖子包围的空腔。 入口延伸穿过一个盖子，出口延伸穿过另一个盖子。 分离管设置在地壳的空腔中并与地壳的入口和出口连通。 多个孔被限定在分离管的主体中并且与分离管和地壳的空腔内的空间连通。 溶解有气体的液体通过外壳的入口进入分离管。 液体被分离管脱气。 脱气液体经由外壳的出口离开分离管。

公开(公告)号：US20080075611A1

公开(公告)日：2008-03-27

申请号：US11309748

申请日：2006-09-21

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F04B17/00

CPC分类号： F04D13/0606

摘要： A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates the liquid firstly enters the second chamber via an inlet (122) and flows through the filter, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to flow out of the liquid cooling device via an outlet (124).

摘要翻译： 微型液体冷却装置包括限定第一室（102）的壳体（10），与第一室连通的第二室（104）和第三室（106）。 第一和第三室协同地形成液体的工作通道。 叶轮（21）可旋转地安装在第一室中以使液体循环。 过滤器（17）安装在第二室中并限定多个孔（1704）。 当叶轮旋转时，液体首先通过入口（122）进入第二室并流过过滤器，由此液体中的气泡离开液体并经过孔从过滤器逸出。 逸出的气泡进入第二个室。 脱气液体流入工作通道，最后通过出口（124）被驱动流出液体冷却装置。

公开(公告)号：US07333338B2

公开(公告)日：2008-02-19

申请号：US11308073

申请日：2006-03-05

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

摘要翻译： 存储模块组件（1）包括其上具有电子发热电子部件（40）的印刷电路板（10），散热器（20）和夹子（30），用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分（32）和一对闩锁部分（33）。 每个闩锁部分包括锁定腿部（332）和形成在锁定腿部的底端处的保持钩部分（334）。 保持钩部分紧密接合印刷电路板的底面，并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造，并且不与印刷电路板的周边侧连通。

公开(公告)号：US20070206359A1

公开(公告)日：2007-09-06

申请号：US11308073

申请日：2006-03-05

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

摘要翻译： 存储模块组件（1）包括其上具有电子发热电子部件（40）的印刷电路板（10），散热器（20）和夹子（30），用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分（32）和一对闩锁部分（33）。 每个闩锁部分包括锁定腿部（332）和形成在锁定腿部的底端处的保持钩部分（334）。 保持钩部分紧密接合印刷电路板的底面，并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造，并且不与印刷电路板的周边侧连通。