公开(公告)号：US20070108561A1

公开(公告)日：2007-05-17

申请号：US11525446

申请日：2006-09-22

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L23/495

CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.

Abstract translation: 图像传感器芯片封装（200）包括载体（20），图像传感器芯片（30），多个导线（50）和保持器（60）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有第一端子部分（236）和连接第一和第二端子部分的互连部分（237）。 芯片安装在载体上，并具有有效区域（301）和多个触点（302）。 导线将芯片的触点与引线框架的第一端子部分电连接。 保持器安装到载体上以封闭空腔，并允许光通过，以到达芯片的有效区域。

公开(公告)号：US20070057150A1

公开(公告)日：2007-03-15

申请号：US11478503

申请日：2006-06-28

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L27/00

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

公开(公告)号：US20070057148A1

公开(公告)日：2007-03-15

申请号：US11453454

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01J5/02 ,  H01L27/00

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。 第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。 最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

公开(公告)号：US20060290802A1

公开(公告)日：2006-12-28

申请号：US11402467

申请日：2006-04-12

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254

Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

公开(公告)号：US20060093352A1

公开(公告)日：2006-05-04

申请号：US11262592

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: G03B17/00

CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

公开(公告)号：US07643081B2

公开(公告)日：2010-01-05

申请号：US11402467

申请日：2006-04-12

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254

Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

公开(公告)号：US07626160B2

公开(公告)日：2009-12-01

申请号：US11617627

申请日：2006-12-28

Applicant: Ying-Cheng Wu ,  Chun-Hung Lin

Inventor： Ying-Cheng Wu ,  Chun-Hung Lin

IPC: H01J40/14

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/8592

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract translation: 图像传感器封装（110）包括基板（111），支撑件（113），图像传感器（112），多根电线（114），主粘合剂（115）和盖板（116）。 支撑体包括通孔和形成在通孔周围的多个顶部焊盘（113c），并且支撑件安装在基板上并电连接到基板。 图像传感器安装在基板上并被接收在通孔中，图像传感器包括感测部分（112b）和多个触点（112a）。 电线将顶部焊盘电连接到触点。 主要粘合剂被施加在图像传感器上并且围绕感测部分。 支撑在主粘合剂上的盖板，盖板和主粘合剂协同地包围图像传感器的感测部分。

公开(公告)号：US07595839B2

公开(公告)日：2009-09-29

申请号：US11595331

申请日：2006-11-10

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片被嵌入在基座中并且彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

公开(公告)号：US07592197B2

公开(公告)日：2009-09-22

申请号：US11453456

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01L21/00

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 图像传感器封装方法包括以下步骤：首先，提供包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应导电片之一电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

公开(公告)号：US07515254B2

公开(公告)日：2009-04-07

申请号：US11644256

申请日：2006-12-21

Applicant: Ching-Lung Jao

Inventor： Ching-Lung Jao

IPC: G01B9/00

CPC classification number: G01M11/0257

Abstract: A reflection-testing device for testing for unwanted reflections in a lens module (12) includes a plurality of light sources (18) and an image capturer (16). The plurality of light sources is provided around the top end of the lens module, and the image capturer is provided near the other end of the lens module for receiving optical signals through the lens module. A lens reflection testing method is also disclosed.

Abstract translation: 用于测试透镜模块（12）中的不需要的反射的反射测试装置包括多个光源（18）和图像捕获器（16）。 多个光源设置在透镜模块的顶端周围，并且图像捕获器设置在透镜模块的另一端附近，用于通过透镜模块接收光信号。 还公开了透镜反射测试方法。