Abstract:
The burn-in apparatus includes a water supply system and a sprayer and has a structure such that water is converted into mist and sprayed onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates high heat is removed by the amount of heat that includes a large latent heat from when the mist falls on the upper surface and is evaporated. Burn-in of the device is conducted while it is being cooled to the target temperature.
Abstract:
A fuel-cell evaluation equipment includes a gas passageway for supplying gas to a fuel cell and a thermostat adapted to accommodate the fuel cell, wherein the gas passageway includes a first temperature regulator adapted to regulate the temperature of gas and a humidity regulator adapted to regulate the humidity of the gas. A thermostatic chamber of the thermostat regulates an inner temperature in the chamber according to a test condition. The thermostatic chamber is provided with a second temperature regulator into which gas flowing in the gas passageway flows. The gas flowing in the gas passageway is supplied to the fuel cell after heat exchange by the second temperature regulator.
Abstract:
A second tank for accommodating a sample is disposed within a first tank. A heater for heating gas is provided inside the second tank. A heater controller controls the heater such that temperature of gas becomes a set temperature. A guide portion which guides condensed dew such that the condensed dew can flow downward and reach the outer surface of the second tank is provided on the inner surface of the first tank.
Abstract:
An IC socket comprises a plurality of conductive connecting sections each having a holding section for holding one of a plurality of lead terminals of an IC; and a plurality of conductive coil springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections.
Abstract:
Input and output of small-current signals between a mother board and semiconductor devices subjected to a burn-in test are made via a device driving unit. Large-current main power is supplied via the device driving unit through bus bars without passing through the mother board. In this way, the risk of burn-out in a burn-in substrate and burn-in sockets, and damages caused by a burn-out can be reduced even when it occurs.
Abstract:
A disc-type unit 10 adjusts temperature of a control face 14 by means of a heater 12 and coolant, with a hollow plate 11 to which the heater 12 is secured, a cavity 13 formed in the hollow plate 11 and a piping 20 for supplying the coolant to the cavity 13, the piping 20 opening in the cavity 13, and the coolant being jetted to a portion to which the heater 12 is secured or a portion in proximity thereto and which shows high temperature rise when energizing the heater 12.
Abstract:
An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor devices and first terminals extending from the sockets to protrude from a first back side of the burn-in board. The driver board has a second surface carrying an electronic circuit to drive the semiconductor devices and a second back side with second terminals for connecting the electronic circuit to the first terminals. The driver board has an edge connector with terminals for applying power to the electronic circuit. The burn-in board and the driver board are disposed with the first and second back sides facing such that corresponding ones of the first and second terminal can be brought into and out of contact with each other. The board assemblies are supported in a housing wherein the board assemblies form partitions isolating first and second environmental spaces for burn-in and cooling operation. A flexible seal is provided between the burn-in board and the driver board to permit said first and second terminals to be brought into contact with each other by pneumatic operation.
Abstract:
In a snow accretion test method, a snow accumulation step of accumulating snow on a specimen, and a snow accretion step of freezing snow accumulated on the specimen in a state where snow is not supplied to the specimen are performed. The snow accumulation step and the snow accretion step are repeatedly performed. In the snow accretion step, the ambient temperature of the specimen is adjusted to a temperature lower than the ambient temperature in the snow accumulation step.
Abstract:
An information processing device acquires operation information by a user regarding setting of the operation control information, arrays and displays, independently for each type on a setting screen, a plurality of types of setting parts corresponding to a plurality of types of control setting items included in the operation control information based on the operation information having been acquired, and generates the operation control information based on the arrayed information, and outputs the operation control information having been generated.
Abstract:
An environmental testing apparatus includes: a plurality of blower fans that circulate air-conditioned air between an air conditioning chamber and a test chamber; a plurality of temperature sensors that measure temperature at a plurality of locations in the test chamber and output temperature data; and a control unit that can individually set rotation speed of each blower fan. The control unit executes setting processing for setting the rotation speed of each blower fan in a testing period in a setting period before the testing period. In the setting processing, the control unit changes the rotation speed of the plurality of blower fans a plurality of times, and acquires a plurality of temperature data after each change from the plurality of temperature sensors.